MPC866TZP133A vs MPC859TVR133A Comparaison
Comparaison détaillée côte à côte de MPC866TZP133A par NXP Semiconductors et MPC859TVR133A par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
MPC866TZP133A - MPC8xx PowerQUICC 133MHz BGA Processor | NXP
MPC866TZP133A ObsoleteNXP Semiconductors
MPC859TVR133A - 133MHz PowerQUICC MPU, 32-Bit | NXP | 357-PBGA
MPC859TVR133A ✗ Fin de vieComparaison des spécifications
| Paramètre | MPC866TZP133A | MPC859TVR133A |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Obsolete | Fin de vie |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $25,40 | $54,10 |
| Core Processor | MPC8xx Power Architecture (32-bit) | — |
| Core Speed | 133 MHz | — |
| External Bus Speed | 66 MHz | — |
| Number of Cores | 1 Core, 32-Bit | 1 |
| Co-Processors / DSP | Communications Processor Module (CPM) | — |
| Core Supply Voltage | 1.8 V | — |
| I/O Supply Voltage | 3.3 V (5 V TTL tolerant inputs) | — |
| Process Technology | 0.18 µm CMOS | — |
| Boîtier | 357-PBGA (25x25 mm, 1.0 mm pitch) | — |
| Ethernet MACs | 4 x 10/100 Mbps + 2 x 10 Mbps | — |
| RAM Controllers | DRAM (up to 16 banks), SRAM, EPROM, Flash | — |
| Graphics Acceleration | No | — |
| Température de fonctionnement | 0 °C to +95 °C | 0C to +95C (commercial/industrial grade) |
| Lead Free Status | Contains Lead | — |
| Statut RoHS | Non-Compliant (contains lead - per datasheet) | See manufacturer PCN (legacy status) |
| Part Status | Obsolete | — |
| Packaging | Tray | — |
| Manufacturer | — | NXP Semiconductors (formerly Freescale Semiconductor) |
| Series | — | PowerQUICC, MPC8xx family |
| Core Architecture | — | Power Architecture (32-bit) |
| Core / Series Name | — | MPC8xx |
| Fréquence d'horloge maximale | — | 133 MHz |
| Largeur du bus de données | — | 32 bit |
| Package Type | — | 357-PBGA (Plastic Ball Grid Array) |
| Package Dimensions | — | 25 x 25 mm |
| On-Chip Cache | — | 8 KB instruction / 8 KB data (per datasheet family) |
| Communication Channels | — | 4 SCC, 2 SMC, 1 FCC (typical MPC859T configuration) |
| Peripheral Interfaces | — | SPI, I2C, PCMCIA, IDMA, UART |
| Type de montage | — | Surface Mount (BGA) |
| Lifecycle | — | End-of-Life per NXP product page |