MPC866TZP133A vs MPC859TVR133A Comparación
Comparación detallada lado a lado de MPC866TZP133A por NXP Semiconductors y MPC859TVR133A por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MPC866TZP133A - MPC8xx PowerQUICC 133MHz BGA Processor | NXP
MPC866TZP133A ObsoleteNXP Semiconductors
MPC859TVR133A - 133MHz PowerQUICC MPU, 32-Bit | NXP | 357-PBGA
MPC859TVR133A ✗ Fin de vidaComparación de especificaciones
| Parámetro | MPC866TZP133A | MPC859TVR133A |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Obsolete | Fin de vida |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $25,40 | $54,10 |
| Core Processor | MPC8xx Power Architecture (32-bit) | — |
| Core Speed | 133 MHz | — |
| External Bus Speed | 66 MHz | — |
| Number of Cores | 1 Core, 32-Bit | 1 |
| Co-Processors / DSP | Communications Processor Module (CPM) | — |
| Core Supply Voltage | 1.8 V | — |
| I/O Supply Voltage | 3.3 V (5 V TTL tolerant inputs) | — |
| Process Technology | 0.18 µm CMOS | — |
| Encapsulado | 357-PBGA (25x25 mm, 1.0 mm pitch) | — |
| Ethernet MACs | 4 x 10/100 Mbps + 2 x 10 Mbps | — |
| RAM Controllers | DRAM (up to 16 banks), SRAM, EPROM, Flash | — |
| Graphics Acceleration | No | — |
| Temperatura de funcionamiento | 0 °C to +95 °C | 0C to +95C (commercial/industrial grade) |
| Lead Free Status | Contains Lead | — |
| Estado RoHS | Non-Compliant (contains lead - per datasheet) | See manufacturer PCN (legacy status) |
| Part Status | Obsolete | — |
| Packaging | Tray | — |
| Manufacturer | — | NXP Semiconductors (formerly Freescale Semiconductor) |
| Series | — | PowerQUICC, MPC8xx family |
| Core Architecture | — | Power Architecture (32-bit) |
| Core / Series Name | — | MPC8xx |
| Frecuencia de reloj máxima | — | 133 MHz |
| Ancho del bus de datos | — | 32 bit |
| Package Type | — | 357-PBGA (Plastic Ball Grid Array) |
| Package Dimensions | — | 25 x 25 mm |
| On-Chip Cache | — | 8 KB instruction / 8 KB data (per datasheet family) |
| Communication Channels | — | 4 SCC, 2 SMC, 1 FCC (typical MPC859T configuration) |
| Peripheral Interfaces | — | SPI, I2C, PCMCIA, IDMA, UART |
| Tipo de montaje | — | Surface Mount (BGA) |
| Lifecycle | — | End-of-Life per NXP product page |