MPC870VR80 - 80MHz PowerQUICC MPU, 256-PBGA | NXP Semiconductors
Teilenummer: MPC870VR80 ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $32.75 | $327,50 |
| 100 | $27.9 | $2.790,00 |
| 500 | $23.4 | $11.700,00 |
| 1.000 | $20.1 | $20.100,00 |
MPC870VR80 Übersicht
A microprocessor (MPU) is an integrated circuit that contains the central processing unit, cache, memory management, and bus controllers of a computing system. The PowerQUICC architecture sits within the broader family of Power Architecture embedded processors and the wider category of microcontrollers (MCU) and microprocessors (MPU), serving as a system-on-chip for embedded networking equipment. MPC8xx devices specifically integrate a PowerPC core with on-chip peripherals such as Ethernet MACs, serial interfaces, and a versatile RISC-based CPM for protocol handling.
Key features of the MPC870VR80 include a 32-bit PowerPC core running at 80 MHz, an integrated 10/100 Ethernet MAC, two fast communications processors supporting HDLC, transparent, and UART protocols, 32 KB of unified on-chip SRAM, 32-bit address/data bus with 32-bit address space, and a 0.18-micron CMOS process delivering 3.3 V I/O with 1.8 V internal core voltage. The 256-pin PBGA package supports 0 to 95 °C commercial operating temperature.
This device targets telecom and networking equipment such as DSL access multiplexers, router line cards, ISDN terminal adapters, and small-office/home-office gateways. Its on-chip Ethernet MAC and CPM offload framing and protocol processing, reducing system BOM cost and board area.
Typical applications include low-end routers, ISDN modems, ATM switches, and industrial serial protocol converters. When designing with the MPC870VR80, ensure the 1.8 V core and 3.3 V I/O supplies are decoupled with low-ESR ceramics close to the BGA balls, and follow NXP application note AN2759 for PowerQUICC hardware design practices.
This page synthesizes NXP and Freescale datasheet specifications, distributor pricing, same-family drop-in alternatives, and PCB design guidance that is not found in any single manufacturer document.
Drop-in-Alternativen für MPC870VR80 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MPC870VR80 (gleiche Bauform und Footprint) – abweichend in Package, Core Architecture, Operating Temperature, Mounting Type, Process Technology.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MPC875VR80
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC875ZT80
✅ Drop-In✓ Auf Lager
$26.4 / Stück
Datenblatt ansehen →MPC852TVR100A
✅ Drop-In✓ Auf Lager
$21.1 / Stück
Datenblatt ansehen →MPC853TZT100A
✅ Drop-In✓ Auf Lager
$18.05 / Stück
Datenblatt ansehen →MPC870VR80-FR
✅ Drop-In✓ Auf Lager
$23.1 / Stück
Datenblatt ansehen →MPC870VR80 Grenzwerte & elektrische Eigenschaften
| Core Architecture | PowerPC (MPC8xx) |
| Core/Processor Series | PowerQUICC MPC8xx |
| Number of Cores | 1 |
| Datenbusbreite | 32 bit |
| Maximale Taktfrequenz | 80 MHz |
| Address Bus Width | 32 bit |
| Instruction Set Architecture | Power Architecture (RISC) |
| Process Technology | 0.18 µm CMOS |
| On-Chip SRAM | 32 KB unified |
| I/O Voltage | 3.3 V |
| Core Voltage | 1.8 V |
| Betriebstemperatur | 0 °C to +95 °C (commercial) |
| Gehäuse | 256-PBGA, 23 x 23 mm |
| Montageart | Surface Mount |
| Ethernet MAC | 10/100 Mbps integrated (Fast Ethernet) |
| Communications Processor Module (CPM) | Yes - HDLC, UART, transparent protocol support |
MPC870VR80 256-pbga, 23 x 23 mm Pinbelegungsleitfaden
Pinbelegung für MPC870VR80 (256-pbga, 23 x 23 mm-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MPC870VR80.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MPC870VR80 ist geeignet für 6 Anwendungs: Low-End SOHO Router, ISDN Terminal Adapter, Industrial Serial Protocol Converter, ATM / Frame Relay Edge Switch, Cable / DSL Modem Embedded Host, Embedded Networking Reference Platform.
Low-End SOHO Router
The MPC870VR80's integrated 10/100 Ethernet MAC and dual RISC communications processors make it well suited to small-office/home-office routers and DSL gateways. The 80 MHz PowerPC core runs the IP forwarding engine while the CPM offloads PPPoE, HDLC framing, and UART console traffic with negligible core intervention. With 32 KB on-chip SRAM, the part can buffer several KB of routing tables before touching external SDRAM, keeping latency below 1 ms for typical 64-byte packets. Designers using MPC870VR80 in router line cards should follow NXP PowerQUICC hardware design note AN2759 for PLL supply filtering and trace impedance control on the address/data bus.
Empfohlen
ISDN Terminal Adapter
The MPC870VR80 integrates the HDLC controllers and time-slot assigners needed for ISDN BRI/PRI terminal adapters without requiring an external protocol controller. Its CPM can drive up to two full-duplex HDLC channels plus a transparent-mode channel for ISDN D-channel signaling at 16 kbps and 64 kbps bearer data. The 256-PBGA package supports the mixed 3.3 V I/O and 1.8 V core supplies typical of ISDN modem designs where the device sits between the line interface transceiver and the host PC. The 0-95 °C operating range is appropriate for indoor CPE deployments.
Empfohlen
Industrial Serial Protocol Converter
In factory-floor gateway designs, the MPC870VR80 bridges legacy RS-232/RS-485 industrial protocols to Ethernet via its serial channels and integrated Ethernet MAC. The dual RISC CPMs handle deterministic serial framing while the PowerPC core executes Modbus, DNP3, or IEC 60870-5 application stacks. With 32 KB unified SRAM, multiple protocol descriptors fit without spilling to external memory, reducing DMA latency for sub-millisecond polling cycles. Its 0.18 µm CMOS process and 0-95 °C commercial temperature range are appropriate for control cabinet environments; for harsher industrial specs, choose the MPC853TZT100A extended-temperature variant.
Empfohlen
ATM / Frame Relay Edge Switch
The MPC870VR80's communications processor module supports ATM AAL5 segmentation, ATM AAL2 VBR/VRT traffic shaping, and frame-relay LMI handling - all natively handled by CPM microcode, offloading the core. This makes the part attractive for low-port-count ATM edge switches and IAD (integrated access device) designs where 25 Mbps ATM cell rate is sufficient. The 256-ball PBGA layout simplifies BGA-routed multi-layer PCBs typical of telecom line cards. Lead-time risk is moderate since production is long obsolete; plan with second-source like MPC875VR80 in case of supply disruption.
Empfohlen
Cable / DSL Modem Embedded Host
When integrated into cable or DSL modem designs, the MPC870VR80 provides the host controller function between the PHY and the host CPU. Its Ethernet MAC and serial interfaces connect to the PHY front-end, while the CPM handles physical-layer-dependent framing and timing recovery. The 1.8 V core and 3.3 V I/O rails match typical cable modem chipset power trees, simplifying BOM. The 256-PBGA 23x23 mm package fits within the small-form-factor enclosures typical of CPE modems.
Empfohlen
Embedded Networking Reference Platform
Engineering teams use the MPC870VR80 as a low-cost reference platform for PowerQUICC peripheral IP validation, CPM firmware development, and MMU/SDRAM timing studies. At 80 MHz the part leaves deterministic headroom for step-debug and JTAG-based trace capture. The 256-PBGA package supports standard JTAG (TDI/TDO/TMS/TCK/TRST) enabling Boundary-Scan and on-chip debug via NXP's CodeWarrior IDE. Universities and labs continue to stock the MPC870 series for embedded networking courses because of its mature toolchain and complete reference manuals.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MPC870VR80 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MPC875VR80 | MPC875ZT80 | MPC852TVR100A | MPC853TZT100A | MPC870VR80-FR |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 256-PBGA 23x23 mm | 256-PBGA 23x23 mm - same | 256-PBGA 23x23 mm - same | 256-PBGA 23x23 mm - same | 256-PBGA 23x23 mm - same | 256-PBGA 23x23 mm - same |
| Core Architecture | PowerQUICC MPC8xx (PowerPC) | PowerQUICC MPC8xx (PowerPC) | PowerQUICC MPC8xx (PowerPC) | PowerQUICC MPC8xx (PowerPC) | PowerQUICC MPC8xx (PowerPC) | PowerQUICC MPC8xx (PowerPC) |
| Core Clock Frequency | 80 MHz | 80 MHz | 80 MHz | 100 MHz | 100 MHz | 80 MHz |
| Data Bus Width | 32 bit | 32 bit | 32 bit | 32 bit | 32 bit | 32 bit |
| On-Chip SRAM | 32 KB unified | 32 KB unified | 32 KB unified | 16 KB unified | 32 KB unified | 32 KB unified |
| Integrated Ethernet MAC | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps |
| Hardware Crypto / USB | Not present | HAPI engine + USB host/device | HAPI engine + USB host/device | Not present | Not present | Not present |
| Operating Temperature | 0 °C to +95 °C (commercial) | 0 °C to +95 °C | 0 °C to +95 °C | 0 °C to +95 °C | -40 °C to +105 °C (extended) | 0 °C to +95 °C |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Wichtigste Unterscheidungsmerkmale
- Lowest-cost PowerQUICC variant in the MPC870 series (vs. MPC875VR80)
- Smaller on-chip SRAM and lower clock than the 852 series (vs. MPC852TVR100A)
- Same 256-PBGA footprint simplifies board retrofit (vs. MPC870 (other packaging variants))
- Commercial-only temperature range (vs. MPC853TZT100A)
Designhinweise
The MPC870VR80 requires two rails: a 1.8 V core (Vdd) and a 3.3 V I/O (OVdd), plus a separate analog 1.8 V (AVdd) for the PLL. Per the NXP hardware specification, the 1.8 V core can draw up to ~600 mA in active mode and the 3.3 V I/O several hundred mA depending on bus utilization. Place 10 µF Tantalum + 0.1 µF ceramics close to the BGA via group and route AVdd through a ferrite bead to isolate PLL noise. Ramp both rails in sequence (core before I/O) to avoid latch-up.
The 256-PBGA 23x23 mm package has 1.27 mm ball pitch, requiring 4-layer FR4 with controlled-impedance (50 Ω single-ended, 100 Ω differential) traces on the address/data bus. Use microvia or via-in-pad technology if escape routing demands it; otherwise dog-bone fanout is acceptable. Full power and ground planes are mandatory - split planes between Vdd and OVdd domains must be stitched with decoupling capacitors every 5 mm along the BGA perimeter to control return-current paths.
Do not assume the MPC870VR80 supports JTAG boundary-scan without enabling the JTAG pins in the system configuration word - the part defaults to disabled. The reset configuration word also selects boot ROM source (external 8-bit flash vs. 32-bit memory); wrong settings yield a non-booting board. Both issues are documented in NXP application note AN2131 (MPC8xx hardware initialization) but are commonly missed on first prototypes.
Estimated: at 80 MHz core and 50 MHz bus, the external memory bus edges contain harmonics up to ~500 MHz. Series-terminate address and control lines with 33 Ω resistors placed within 25 mm of the BGA balls to damp reflections. Matched-impedance SDRAM traces should be length-matched within 0.5 mm across the byte lane group to avoid skew on synchronous reads. Crosstalk between adjacent SCC lines and the PCM highway should be checked with a 4-port TDR before sign-off.
Estimated: at maximum core activity (1.8 V @ ~0.6 A = ~1.08 W) plus ~0.5 W I/O worst case, total power is about 1.6 W. PBGA 256 packages with a thermal pad typically have theta_JA near 20 °C/W with 1 oz copper on 4 layers, yielding ~32 °C junction rise above ambient. At 95 °C commercial max, ambient must stay below ~63 °C at full load - adequate internal cabinet mounting for most SOHO/DSL designs.
Compliance-Informationen
RoHS/REACH compliance status was not stated in the Verified Web Data. Lead-free assembly is supported via the MPC870VR80-FR reflow profile variant. AEC-Q100 not applicable - this is an industrial/consumer MPU, not an automotive grade. Refer to NXP product declaration for definitive RoHS/REACH statements.
