MPC885CZP66 vs MPC885VR66 Vergleich

Detaillierter Direktvergleich von MPC885CZP66 von NXP Semiconductors und MPC885VR66 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MPC885CZP66 MPC885CZP66 - 66MHz PowerQUICC MPU, 32-Bit, 357-BGA | NXP

MPC885CZP66 - 66MHz PowerQUICC MPU, 32-Bit, 357-BGA | NXP

MPC885CZP66 Nrnd
NXP Semiconductors
MPC885VR66 MPC885VR66 - 66MHz 32-Bit PowerQUICC MPU | NXP Semiconductors

MPC885VR66 - 66MHz 32-Bit PowerQUICC MPU | NXP Semiconductors

MPC885VR66 ✗ Abgekündigt

Spezifikationsvergleich

Parameter MPC885CZP66 MPC885VR66
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus NRND Ende des Lebenszyklus
Manufacturer NXP Semiconductors NXP Semiconductors
Series PowerQUICC, MPC8xx —
Core Architecture Power Architecture, 32-bit —
Core Count 1 1 core
Datenbusbreite 32 bit —
Core Clock Speed 66 MHz —
Process Technology 0.18 micrometer CMOS 0.18 um
Versorgungsspannung 3.3 V (typical) 3.3 V
Package Type PBGA (Plastic Ball Grid Array) —
Package Pin Count 357 —
Package Size 25 x 25 mm —
Montageart Surface Mount Surface Mount
Moisture Sensitivity Level MSL 3 —
Betriebstemperatur -40C to +100C —
Terminal Form Ball —
Package Code BGA —
Package Shape Square —
RoHS-Status [DATA_NEEDED: RoHS compliance status] RoHS Compliant
Lead-Free [DATA_NEEDED: lead-free status] —
Product Type — PowerQUICC Communications Processor
Processor Architecture — 32-Bit Power Architecture
Maximale Taktfrequenz — 66 MHz
Advertised Performance — 87 MIPS
Gehäuse — 357-PBGA (25 x 25 mm)
Package Family — 357-BBGA
Packaging — Tray
Betriebstemperaturbereich — 0°C to 95°C
Lebenszyklusstatus — End of Life
Lead-Free Status — Lead Free
REACH Status — [DATA_NEEDED: REACH compliance status]
AEC-Q100 Qualification — [DATA_NEEDED: AEC-Q100 qualification status]
Internal Memory Configuration — [DATA_NEEDED: cache, SRAM, and ROM configuration]
External Memory Interfaces — [DATA_NEEDED: supported external memory interfaces]
Ethernet Capability — [DATA_NEEDED: Ethernet controller configuration]
Serial Interface Configuration — [DATA_NEEDED: UART, SPI, I2C, and CAN interface details]

Datenblätter & Ressourcen

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