MPC885CZP66 vs MPC885VR66 对比
详细并排对比 MPC885CZP66 出自 NXP Semiconductors 和 MPC885VR66 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | MPC885CZP66 | MPC885VR66 |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 不推荐新设计 | 停产 |
| Manufacturer | NXP Semiconductors | NXP Semiconductors |
| Series | PowerQUICC, MPC8xx | — |
| Core Architecture | Power Architecture, 32-bit | — |
| Core Count | 1 | 1 core |
| 数据总线宽度 | 32 bit | — |
| Core Clock Speed | 66 MHz | — |
| Process Technology | 0.18 micrometer CMOS | 0.18 um |
| 电源电压 | 3.3 V (typical) | 3.3 V |
| Package Type | PBGA (Plastic Ball Grid Array) | — |
| Package Pin Count | 357 | — |
| Package Size | 25 x 25 mm | — |
| 安装类型 | Surface Mount | Surface Mount |
| Moisture Sensitivity Level | MSL 3 | — |
| 工作温度 | -40C to +100C | — |
| Terminal Form | Ball | — |
| Package Code | BGA | — |
| Package Shape | Square | — |
| RoHS 状态 | [DATA_NEEDED: RoHS compliance status] | RoHS Compliant |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Product Type | — | PowerQUICC Communications Processor |
| Processor Architecture | — | 32-Bit Power Architecture |
| 最大时钟频率 | — | 66 MHz |
| Advertised Performance | — | 87 MIPS |
| 封装 | — | 357-PBGA (25 x 25 mm) |
| Package Family | — | 357-BBGA |
| Packaging | — | Tray |
| 工作温度范围 | — | 0°C to 95°C |
| 生命周期状态 | — | End of Life |
| Lead-Free Status | — | Lead Free |
| REACH Status | — | [DATA_NEEDED: REACH compliance status] |
| AEC-Q100 Qualification | — | [DATA_NEEDED: AEC-Q100 qualification status] |
| Internal Memory Configuration | — | [DATA_NEEDED: cache, SRAM, and ROM configuration] |
| External Memory Interfaces | — | [DATA_NEEDED: supported external memory interfaces] |
| Ethernet Capability | — | [DATA_NEEDED: Ethernet controller configuration] |
| Serial Interface Configuration | — | [DATA_NEEDED: UART, SPI, I2C, and CAN interface details] |