MPC885CZP66 vs MPC885VR66 비교
다음의 상세 나란히 비교: MPC885CZP66 제조: NXP Semiconductors 및 MPC885VR66 제조: NXP Semiconductors. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
사양 비교
| 파라미터 | MPC885CZP66 | MPC885VR66 |
|---|---|---|
| 브랜드 | NXP Semiconductors | NXP Semiconductors |
| 카테고리 | Microcontrollers | Microcontrollers |
| 수명 주기 상태 | NRND | 수명 종료 |
| Manufacturer | NXP Semiconductors | NXP Semiconductors |
| Series | PowerQUICC, MPC8xx | — |
| Core Architecture | Power Architecture, 32-bit | — |
| Core Count | 1 | 1 core |
| 데이터 버스 폭 | 32 bit | — |
| Core Clock Speed | 66 MHz | — |
| Process Technology | 0.18 micrometer CMOS | 0.18 um |
| 공급 전압 | 3.3 V (typical) | 3.3 V |
| Package Type | PBGA (Plastic Ball Grid Array) | — |
| Package Pin Count | 357 | — |
| Package Size | 25 x 25 mm | — |
| 실장 유형 | Surface Mount | Surface Mount |
| Moisture Sensitivity Level | MSL 3 | — |
| 동작 온도 | -40C to +100C | — |
| Terminal Form | Ball | — |
| Package Code | BGA | — |
| Package Shape | Square | — |
| RoHS 상태 | [DATA_NEEDED: RoHS compliance status] | RoHS Compliant |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Product Type | — | PowerQUICC Communications Processor |
| Processor Architecture | — | 32-Bit Power Architecture |
| 최대 클록 주파수 | — | 66 MHz |
| Advertised Performance | — | 87 MIPS |
| 패키지 | — | 357-PBGA (25 x 25 mm) |
| Package Family | — | 357-BBGA |
| Packaging | — | Tray |
| 동작 온도 범위 | — | 0°C to 95°C |
| 수명 주기 상태 | — | End of Life |
| Lead-Free Status | — | Lead Free |
| REACH Status | — | [DATA_NEEDED: REACH compliance status] |
| AEC-Q100 Qualification | — | [DATA_NEEDED: AEC-Q100 qualification status] |
| Internal Memory Configuration | — | [DATA_NEEDED: cache, SRAM, and ROM configuration] |
| External Memory Interfaces | — | [DATA_NEEDED: supported external memory interfaces] |
| Ethernet Capability | — | [DATA_NEEDED: Ethernet controller configuration] |
| Serial Interface Configuration | — | [DATA_NEEDED: UART, SPI, I2C, and CAN interface details] |