MPX2010D vs MPXM2010GS Vergleich

Detaillierter Direktvergleich von MPX2010D von STMicroelectronics und MPXM2010GS von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MPXM2010GS MPXM2010GS - 10kPa Vented Gauge Pressure Sensor | NXP/STMicro

MPXM2010GS - 10kPa Vented Gauge Pressure Sensor | NXP/STMicro

MPXM2010GS ✓ Aktiv

Spezifikationsvergleich

Parameter MPX2010D MPXM2010GS
Marke STMicroelectronics NXP Semiconductors
Kategorie Pressure Sensors Pressure Sensors
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $9,10 $5,62
Pressure Type Differential (Port 1 vs Port 2) Vented Gauge
Operating Pressure Range 0 kPa to 10 kPa (0 PSI to 1.45 PSI) 0 kPa to 10 kPa (0 to 1.45 PSI)
Maximum Overpressure [DATA_NEEDED: maximum overpressure rating] —
Ausgangstyp Analog Wheatstone Bridge (mV) Wheatstone Bridge (analog, differential mV)
Output Voltage Span 0 mV to 25 mV at 10V excitation 0 mV to 25 mV at 10 V excitation
Sensitivity 2.5 mV/kPa (nominal, at 10V excitation) 2.5 mV/kPa (nominal at 10 V)
Excitation Voltage 10 V (typical), 16 V (maximum) 10 V (max 16 V per NXP datasheet)
Linearity 0.1% of full-scale (typical) [DATA_NEEDED: linearity %]
Betriebstemperaturbereich 0 C to +85 C —
Storage Temperature Range [DATA_NEEDED: storage temperature range] —
Gehäuse / Bauform 4-SIP Module (Case 344-15) —
Montageart Through-Hole Surface Mount
Anzahl der Pins 4 —
On-Chip Temperature Compensation Yes (laser trimmed) —
Bridge Configuration 4-arm piezoresistive Wheatstone —
RoHS-Status [DATA_NEEDED: RoHS status from ST datasheet] [DATA_NEEDED: RoHS status]
Sensor Family MPX2010 / MPXV2010G / MPXM2010 —
Diaphragm Type Single monolithic silicon —
Maximum Overload Pressure — [DATA_NEEDED: max overload pressure]
Versorgungsstrom — 6 mA (typical at 10 V excitation)
Betriebstemperatur — -40 °C to +125 °C
Storage Temperature — [DATA_NEEDED: storage temperature]
Temperature Compensation — On-chip (laser-trimmed thin-film)
Port Configuration — Top port, male 0.12" (2.97 mm) tube
Gehäuse — 5-SMD Module, top port
Packing — Reel-Reel 13" Q2 NDP
Min Package Quantity — 400
Min Order Quantity — 400

Datenblätter & Ressourcen

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