MPX2100GP vs MPX2050GP Vergleich
Detaillierter Direktvergleich von MPX2100GP von NXP Semiconductors und MPX2050GP von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MPX2050GP - 50 kPa Vented Gauge Pressure Sensor | NXP / STMicro
MPX2050GP ✓ AktivSpezifikationsvergleich
| Parameter | MPX2100GP | MPX2050GP |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Pressure Sensors | Pressure Sensors |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $10,40 | $9,85 |
| Pressure Type | Vented Gauge | Vented Gauge |
| Operating Pressure Range | 0 to 14.5 psi (0 to 100 kPa) | 0 kPa to 50 kPa (0 PSI to 7.25 PSI) |
| Maximum Overpressure | 58.02 psi (400 kPa) | — |
| Ausgangstyp | Wheatstone Bridge (analog voltage, ratiometric) | Analog Wheatstone Bridge (mV) |
| Full-Scale Span | 40 mV typical at 10 V supply | — |
| Offset | 0 mV minimum at 0 kPa | — |
| Versorgungsspannung | 10 V typical (ratiometric) | — |
| Maximum Operating Current | 6 mA | — |
| Port Size | Male 0.19 in (4.93 mm) barbed tube | — |
| Port Style | Barbed | Male 0.19" (4.93 mm) Tube |
| Gehäuse | 4-SIP Module (Unibody through-hole) | — |
| Montageart | Through-Hole | Through-Hole (SIP, vertical) |
| Temperature Compensation | On-chip, calibrated | — |
| Betriebstemperatur | [DATA_NEEDED: operating temperature range] | 0C to +85C |
| Technology | Silicon piezoresistive, MEMS | Silicon Piezoresistive, MEMS |
| Termination Style | PCB (SIP pins) | — |
| RoHS-Status | unknown | — |
| Maximum Overload Pressure | — | [DATA_NEEDED: maximum overload pressure] |
| Full-Scale Output (Typ @ 10 V) | — | 40 mV (4 mV/V) |
| Zero Offset (Typ) | — | 0 mV |
| Supply / Excitation Voltage | — | 10 V typical (max 16 V per datasheet) |
| Linearity | — | +/-0.05% to +/-0.1% of FSS (typ) |
| Pressure Hysteresis | — | < 0.1% of FSS |
| Storage Temperature | — | [DATA_NEEDED: storage temperature range] |
| Response Time | — | [DATA_NEEDED: response time / bandwidth] |
| Gehäuse / Bauform | — | 4-SIP Module (Case 344B-01) |
| Diaphragm Material | — | Monolithic silicon with integrated strain gauge |
| Compensation | — | On-chip temperature compensated and laser-trimmed |
| Lead-Free / RoHS | — | Yes (RoHS compliant) |