MPX2100GP vs MPX2050GP Comparaison
Comparaison détaillée côte à côte de MPX2100GP par NXP Semiconductors et MPX2050GP par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
MPX2050GP - 50 kPa Vented Gauge Pressure Sensor | NXP / STMicro
MPX2050GP ✓ ActifComparaison des spécifications
| Paramètre | MPX2100GP | MPX2050GP |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Pressure Sensors | Pressure Sensors |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $10,40 | $9,85 |
| Pressure Type | Vented Gauge | Vented Gauge |
| Operating Pressure Range | 0 to 14.5 psi (0 to 100 kPa) | 0 kPa to 50 kPa (0 PSI to 7.25 PSI) |
| Maximum Overpressure | 58.02 psi (400 kPa) | — |
| Type de sortie | Wheatstone Bridge (analog voltage, ratiometric) | Analog Wheatstone Bridge (mV) |
| Full-Scale Span | 40 mV typical at 10 V supply | — |
| Offset | 0 mV minimum at 0 kPa | — |
| Tension d'alimentation | 10 V typical (ratiometric) | — |
| Maximum Operating Current | 6 mA | — |
| Port Size | Male 0.19 in (4.93 mm) barbed tube | — |
| Port Style | Barbed | Male 0.19" (4.93 mm) Tube |
| Boîtier | 4-SIP Module (Unibody through-hole) | — |
| Type de montage | Through-Hole | Through-Hole (SIP, vertical) |
| Temperature Compensation | On-chip, calibrated | — |
| Température de fonctionnement | [DATA_NEEDED: operating temperature range] | 0C to +85C |
| Technology | Silicon piezoresistive, MEMS | Silicon Piezoresistive, MEMS |
| Termination Style | PCB (SIP pins) | — |
| Statut RoHS | unknown | — |
| Maximum Overload Pressure | — | [DATA_NEEDED: maximum overload pressure] |
| Full-Scale Output (Typ @ 10 V) | — | 40 mV (4 mV/V) |
| Zero Offset (Typ) | — | 0 mV |
| Supply / Excitation Voltage | — | 10 V typical (max 16 V per datasheet) |
| Linearity | — | +/-0.05% to +/-0.1% of FSS (typ) |
| Pressure Hysteresis | — | < 0.1% of FSS |
| Storage Temperature | — | [DATA_NEEDED: storage temperature range] |
| Response Time | — | [DATA_NEEDED: response time / bandwidth] |
| Boîtier / Format | — | 4-SIP Module (Case 344B-01) |
| Diaphragm Material | — | Monolithic silicon with integrated strain gauge |
| Compensation | — | On-chip temperature compensated and laser-trimmed |
| Lead-Free / RoHS | — | Yes (RoHS compliant) |