MPX4100A vs MPX2100D Vergleich

Detaillierter Direktvergleich von MPX4100A von NXP Semiconductors und MPX2100D von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MPX4100A MPX4100A - 20-105 kPa Absolute MAP Pressure Sensor | NXP

MPX4100A - 20-105 kPa Absolute MAP Pressure Sensor | NXP

MPX4100A ✓ Aktiv
NXP Semiconductors
MPX2100D MPX2100D - 100kPa Differential Pressure Sensor | NXP/STMicro

MPX2100D - 100kPa Differential Pressure Sensor | NXP/STMicro

MPX2100D ✓ Aktiv

Spezifikationsvergleich

Parameter MPX4100A MPX2100D
Marke NXP Semiconductors NXP Semiconductors
Kategorie Pressure Sensors Pressure Sensors
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $10,85 $17,80
Pressure Type Absolute Differential
Operating Pressure Range 20 kPa to 105 kPa (2.9 PSI to 15.23 PSI) 0 kPa to 100 kPa (0 to 14.5 psi)
Ausgangstyp Analog Voltage Analog ratiometric Wheatstone bridge (millivolts)
Ausgangsspannungsbereich 0.3 V to 4.9 V —
Supply Voltage Range 4.85 V to 5.35 V —
Sensitivity 54 mV/kPa (typical) —
Full-Scale Output (Nominal) 4.9 V at 105 kPa —
Accuracy ±1.8% —
Versorgungsstrom [DATA_NEEDED: typical supply current in mA] —
Betriebstemperaturbereich -40C to +125C -40C to +125C [DATA_NEEDED: confirm exact range from datasheet]
Port Type Single axial port (no hose barb on basic element) —
Gehäuse / Bauform 6-SIP Module (through-hole) —
Montageart Through Hole Through-hole SIP module
Output Response Time [DATA_NEEDED: response time in ms] —
RoHS-Status Compliant Compliant [DATA_NEEDED: confirm from NXP product page]
Output Ratiometric to Vcc Yes —
Full-Scale Span (Typical) — 40 mV at 10 V excitation
Sensitivity (Nominal) — 0.4 mV/kPa
Supply Voltage (Recommended) — 10 V DC
Supply Voltage (Maximum) — 16 V DC
Pressure Port Configuration — Dual axial ports (differential)
Gehäuse — 4-SIP Unibody (UNIBODY4F), 2.54 mm pitch
Package Body Dimensions — 15.56 mm x 15.56 mm x 5.33 mm
On-Chip Temperature Compensation — Yes (factory laser-trimmed)
Technology — Silicon piezoresistive MEMS strain-gauge bridge
Diaphragm Material — Silicon [DATA_NEEDED: confirm]
Linearity — 0.1% to 0.3% typical [DATA_NEEDED: confirm]

Datenblätter & Ressourcen

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