MPX5700DP vs MPX5700GP1117 Vergleich
Detaillierter Direktvergleich von MPX5700DP von NXP Semiconductors und MPX5700GP1117 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MPX5700DP | MPX5700GP1117 |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Pressure Sensors | Pressure Sensors |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Pressure Type | Differential | Vented Gauge |
| Operating Pressure Range | 0 kPa to 700 kPa (0 psi to 101.5 psi) | 0 kPa to 700 kPa (0 to 101.53 PSI) |
| Maximum Overload Pressure | [DATA_NEEDED: maximum overload pressure] | 2100 kPa |
| Ausgangstyp | Analog voltage, ratiometric | Analog voltage, ratiometric |
| Ausgangsspannungsbereich | 0.2 V to 4.7 V | 0.2 V to 4.7 V (at 5 V supply) |
| Full-Scale Span (VFSS) | 4.5 V (typical) | — |
| Versorgungsspannung | 4.75 V to 5.25 V (5 V typical) | 4.75 V to 5.25 V (5 V typical) |
| Versorgungsstrom | [DATA_NEEDED: supply current] | 10 mA typical |
| Accuracy | ±2.5% VFSS (0°C to 85°C) | ±2.5% (0°C to 85°C) |
| Betriebstemperatur | -40°C to +125°C | -40°C to +125°C |
| Response Time | 1 ms (typical) | 1 ms typical |
| Port Style | Dual Male 0.19" (4.93 mm) Tube, Horizontal | GP - vertical port with 4.93 mm (0.19 in) tube |
| Gehäuse / Bauform | 6-SIP Module (Case 867C-05) | — |
| Montageart | Through-hole, vertical SIP | Through-Hole (vertical port) |
| Technology | Piezoresistive MEMS, bipolar signal conditioning | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | Compliant |
| Compensated Temperature | — | 0°C to 85°C |
| Gehäuse | — | 6-SIP through-hole module |
| Signal Conditioning | — | On-chip amplified, temperature compensated |
| Calibration | — | On-chip laser-trimmed |