MPX5700DP vs MPX5700GP1117 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng MPX5700DP sa pamamagitan ng NXP Semiconductors at MPX5700GP1117 sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
NXP Semiconductors
MPX5700DP - 700 kPa Differential Pressure Sensor, 6-SIP | NXP
MPX5700DP ✓ NakahandaNXP Semiconductors
MPX5700GP1117 - 700 kPa Integrated Pressure Sensor | NXP
MPX5700GP1117 ✓ NakahandaPagsanggunian na paghahambing
| Parametro | MPX5700DP | MPX5700GP1117 |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Kategorya | Pressure Sensors | Pressure Sensors |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Pressure Type | Differential | Vented Gauge |
| Operating Pressure Range | 0 kPa to 700 kPa (0 psi to 101.5 psi) | 0 kPa to 700 kPa (0 to 101.53 PSI) |
| Maximum Overload Pressure | [DATA_NEEDED: maximum overload pressure] | 2100 kPa |
| Type ng Output | Analog voltage, ratiometric | Analog voltage, ratiometric |
| Hanay ng Output Volte | 0.2 V to 4.7 V | 0.2 V to 4.7 V (at 5 V supply) |
| Full-Scale Span (VFSS) | 4.5 V (typical) | — |
| Volte ng Pagbibigay | 4.75 V to 5.25 V (5 V typical) | 4.75 V to 5.25 V (5 V typical) |
| Kuru-kuryente ng Pagbibigay | [DATA_NEEDED: supply current] | 10 mA typical |
| Accuracy | ±2.5% VFSS (0°C to 85°C) | ±2.5% (0°C to 85°C) |
| Temperature na Operasyon | -40°C to +125°C | -40°C to +125°C |
| Response Time | 1 ms (typical) | 1 ms typical |
| Port Style | Dual Male 0.19" (4.93 mm) Tube, Horizontal | GP - vertical port with 4.93 mm (0.19 in) tube |
| Packhaging / Kaso | 6-SIP Module (Case 867C-05) | — |
| Uri ng Pagpapasok | Through-hole, vertical SIP | Through-Hole (vertical port) |
| Technology | Piezoresistive MEMS, bipolar signal conditioning | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Compensated Temperature | — | 0°C to 85°C |
| Packhaging | — | 6-SIP through-hole module |
| Signal Conditioning | — | On-chip amplified, temperature compensated |
| Calibration | — | On-chip laser-trimmed |