MPX5700GP1117 vs MPX5700DP Vergleich
Detaillierter Direktvergleich von MPX5700GP1117 von NXP Semiconductors und MPX5700DP von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MPX5700GP1117 | MPX5700DP |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Pressure Sensors | Pressure Sensors |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Pressure Type | Vented Gauge | Differential |
| Operating Pressure Range | 0 kPa to 700 kPa (0 to 101.53 PSI) | 0 kPa to 700 kPa (0 psi to 101.5 psi) |
| Maximum Overload Pressure | 2100 kPa | [DATA_NEEDED: maximum overload pressure] |
| Versorgungsspannung | 4.75 V to 5.25 V (5 V typical) | 4.75 V to 5.25 V (5 V typical) |
| Versorgungsstrom | 10 mA typical | [DATA_NEEDED: supply current] |
| Ausgangstyp | Analog voltage, ratiometric | Analog voltage, ratiometric |
| Ausgangsspannungsbereich | 0.2 V to 4.7 V (at 5 V supply) | 0.2 V to 4.7 V |
| Accuracy | ±2.5% (0°C to 85°C) | ±2.5% VFSS (0°C to 85°C) |
| Response Time | 1 ms typical | 1 ms (typical) |
| Betriebstemperatur | -40°C to +125°C | -40°C to +125°C |
| Compensated Temperature | 0°C to 85°C | — |
| Port Style | GP - vertical port with 4.93 mm (0.19 in) tube | Dual Male 0.19" (4.93 mm) Tube, Horizontal |
| Gehäuse | 6-SIP through-hole module | — |
| Montageart | Through-Hole (vertical port) | Through-hole, vertical SIP |
| Signal Conditioning | On-chip amplified, temperature compensated | — |
| Calibration | On-chip laser-trimmed | — |
| RoHS-Status | Compliant | [DATA_NEEDED: RoHS status] |
| Full-Scale Span (VFSS) | — | 4.5 V (typical) |
| Gehäuse / Bauform | — | 6-SIP Module (Case 867C-05) |
| Technology | — | Piezoresistive MEMS, bipolar signal conditioning |