MPXM2010GS vs MPX2010D Vergleich

Detaillierter Direktvergleich von MPXM2010GS von NXP Semiconductors und MPX2010D von STMicroelectronics. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MPXM2010GS MPXM2010GS - 10kPa Vented Gauge Pressure Sensor | NXP/STMicro

MPXM2010GS - 10kPa Vented Gauge Pressure Sensor | NXP/STMicro

MPXM2010GS ✓ Aktiv

Spezifikationsvergleich

Parameter MPXM2010GS MPX2010D
Marke NXP Semiconductors STMicroelectronics
Kategorie Pressure Sensors Pressure Sensors
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $5,62 $9,10
Pressure Type Vented Gauge Differential (Port 1 vs Port 2)
Operating Pressure Range 0 kPa to 10 kPa (0 to 1.45 PSI) 0 kPa to 10 kPa (0 PSI to 1.45 PSI)
Maximum Overload Pressure [DATA_NEEDED: max overload pressure] —
Ausgangstyp Wheatstone Bridge (analog, differential mV) Analog Wheatstone Bridge (mV)
Output Voltage Span 0 mV to 25 mV at 10 V excitation 0 mV to 25 mV at 10V excitation
Sensitivity 2.5 mV/kPa (nominal at 10 V) 2.5 mV/kPa (nominal, at 10V excitation)
Excitation Voltage 10 V (max 16 V per NXP datasheet) 10 V (typical), 16 V (maximum)
Versorgungsstrom 6 mA (typical at 10 V excitation) —
Betriebstemperatur -40 °C to +125 °C —
Storage Temperature [DATA_NEEDED: storage temperature] —
Linearity [DATA_NEEDED: linearity %] 0.1% of full-scale (typical)
Temperature Compensation On-chip (laser-trimmed thin-film) —
Port Configuration Top port, male 0.12" (2.97 mm) tube —
Gehäuse 5-SMD Module, top port —
Montageart Surface Mount Through-Hole
Packing Reel-Reel 13" Q2 NDP —
Min Package Quantity 400 —
Min Order Quantity 400 —
RoHS-Status [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status from ST datasheet]
Maximum Overpressure — [DATA_NEEDED: maximum overpressure rating]
Betriebstemperaturbereich — 0 C to +85 C
Storage Temperature Range — [DATA_NEEDED: storage temperature range]
Gehäuse / Bauform — 4-SIP Module (Case 344-15)
Anzahl der Pins — 4
On-Chip Temperature Compensation — Yes (laser trimmed)
Bridge Configuration — 4-arm piezoresistive Wheatstone
Sensor Family — MPX2010 / MPXV2010G / MPXM2010
Diaphragm Type — Single monolithic silicon

Datenblätter & Ressourcen

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