MPXM2010GS vs MPXM2010D Vergleich

Detaillierter Direktvergleich von MPXM2010GS von NXP Semiconductors und MPXM2010D von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MPXM2010GS MPXM2010GS - 10kPa Vented Gauge Pressure Sensor | NXP/STMicro

MPXM2010GS - 10kPa Vented Gauge Pressure Sensor | NXP/STMicro

MPXM2010GS ✓ Aktiv
NXP Semiconductors
MPXM2010D MPXM2010D - 10kPa Differential Pressure Sensor | NXP

MPXM2010D - 10kPa Differential Pressure Sensor | NXP

MPXM2010D ✓ Aktiv

Spezifikationsvergleich

Parameter MPXM2010GS MPXM2010D
Marke NXP Semiconductors NXP Semiconductors
Kategorie Pressure Sensors Pressure Sensors
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $5,62 $4,44
Pressure Type Vented Gauge Differential
Operating Pressure Range 0 kPa to 10 kPa (0 to 1.45 PSI) —
Maximum Overload Pressure [DATA_NEEDED: max overload pressure] —
Ausgangstyp Wheatstone Bridge (analog, differential mV) Wheatstone Bridge
Output Voltage Span 0 mV to 25 mV at 10 V excitation —
Sensitivity 2.5 mV/kPa (nominal at 10 V) —
Excitation Voltage 10 V (max 16 V per NXP datasheet) —
Versorgungsstrom 6 mA (typical at 10 V excitation) —
Betriebstemperatur -40 °C to +125 °C -40 °C to +125 °C
Storage Temperature [DATA_NEEDED: storage temperature] —
Linearity [DATA_NEEDED: linearity %] —
Temperature Compensation On-chip (laser-trimmed thin-film) —
Port Configuration Top port, male 0.12" (2.97 mm) tube Dual vertical-port tubing (modular 'M')
Gehäuse 5-SMD Module, top port —
Montageart Surface Mount Surface Mount (PCB)
Packing Reel-Reel 13" Q2 NDP —
Min Package Quantity 400 —
Min Order Quantity 400 —
RoHS-Status [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
Operating Pressure — 1.45 PSI (10 kPa)
Accuracy — ±1%
Ausgangsspannung — 0 mV to 25 mV at 10 V supply
Versorgungsspannung — 10 V to 16 V
Temperature Compensation Range — 0 °C to +85 °C
Gehäuse / Bauform — 5-SMD Module
Termination Style — PCB
Family Name — MPXM2010D (MPX2010 series)
Technology — Piezoresistive silicon, on-chip calibrated

Datenblätter & Ressourcen

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