MPXM2010GS vs MPXM2010D 比較

詳細並排比較 MPXM2010GS 由 NXP Semiconductors 與 MPXM2010D 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
MPXM2010GS MPXM2010GS - 10kPa Vented Gauge Pressure Sensor | NXP/STMicro

MPXM2010GS - 10kPa Vented Gauge Pressure Sensor | NXP/STMicro

MPXM2010GS ✓ 啟用中
NXP Semiconductors
MPXM2010D MPXM2010D - 10kPa Differential Pressure Sensor | NXP

MPXM2010D - 10kPa Differential Pressure Sensor | NXP

MPXM2010D ✓ 啟用中

規格比較

參數 MPXM2010GS MPXM2010D
品牌 NXP Semiconductors NXP Semiconductors
類別 Pressure Sensors Pressure Sensors
生命週期狀態 啟用中 啟用中
Pressure Type Vented Gauge Differential
Operating Pressure Range 0 kPa to 10 kPa (0 to 1.45 PSI) —
Maximum Overload Pressure [DATA_NEEDED: max overload pressure] —
輸出類型 Wheatstone Bridge (analog, differential mV) Wheatstone Bridge
Output Voltage Span 0 mV to 25 mV at 10 V excitation —
Sensitivity 2.5 mV/kPa (nominal at 10 V) —
Excitation Voltage 10 V (max 16 V per NXP datasheet) —
供應電流 6 mA (typical at 10 V excitation) —
工作溫度 -40 °C to +125 °C -40 °C to +125 °C
Storage Temperature [DATA_NEEDED: storage temperature] —
Linearity [DATA_NEEDED: linearity %] —
Temperature Compensation On-chip (laser-trimmed thin-film) —
Port Configuration Top port, male 0.12" (2.97 mm) tube Dual vertical-port tubing (modular 'M')
封裝 5-SMD Module, top port —
安裝類型 Surface Mount Surface Mount (PCB)
Packing Reel-Reel 13" Q2 NDP —
Min Package Quantity 400 —
Min Order Quantity 400 —
RoHS 狀態 [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
Operating Pressure — 1.45 PSI (10 kPa)
Accuracy — ±1%
輸出電壓 — 0 mV to 25 mV at 10 V supply
供應電壓 — 10 V to 16 V
Temperature Compensation Range — 0 °C to +85 °C
封裝 / 外殼 — 5-SMD Module
Termination Style — PCB
Family Name — MPXM2010D (MPX2010 series)
Technology — Piezoresistive silicon, on-chip calibrated

資料表與資源

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