MRF8S21200HSR6 vs MRF7S19120NR1 Vergleich

Detaillierter Direktvergleich von MRF8S21200HSR6 von NXP Semiconductors und MRF7S19120NR1 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MRF8S21200HSR6 MRF8S21200HSR6 - 48W RF Power LDMOS, 2110-2170 MHz | NXP

MRF8S21200HSR6 - 48W RF Power LDMOS, 2110-2170 MHz | NXP

MRF8S21200HSR6 ✓ Aktiv
NXP Semiconductors
MRF7S19120NR1 MRF7S19120NR1 - 36W RF Power LDMOS, 1930-1990 MHz | NXP

MRF7S19120NR1 - 36W RF Power LDMOS, 1930-1990 MHz | NXP

MRF7S19120NR1 ✓ Aktiv

Spezifikationsvergleich

Parameter MRF8S21200HSR6 MRF7S19120NR1
Marke NXP Semiconductors NXP Semiconductors
Kategorie MOSFETs MOSFETs
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $96,75 $73,00
Transistortyp LDMOS, Dual N-Channel, Enhancement-Mode Lateral MOSFET LDMOS, N-Channel Enhancement-Mode Lateral
Frequency Band 2110 MHz to 2170 MHz —
Output Power (Avg, W-CDMA/LTE) 48 W at 28 V —
Power Gain 18.1 dB —
Test Voltage 28 V —
Test Current (Quiescent) 1.4 A —
Minimum Breakdown Voltage (Drain-Source) 65 V —
Maximum Junction Temperature 225 C —
Mounting Configuration Surface Mount (NI-1230HS ceramic package) —
Application Class Class AB, Class C (cellular base station modulation) —
Peak Reflow Temperature 260 C —
Number of Elements / Configuration Dual, Common Source, 2 Elements —
Lead Free Status Lead Free Lead Free per datasheet
Technology Silicon LDMOS (lateral double-diffused MOSFET) RF Power MOSFET (Gen7 HV8 LDMOS)
Target Modulation W-CDMA, LTE, TD-LTE W-CDMA, CDMA, multi-carrier GSM
Frequency Range — 1930 MHz to 1990 MHz
Output Power (Avg, W-CDMA) — 36 W
Drain-Source Voltage (Vds max) — 65 V (rated)
Test Supply Voltage (Vdd) — 28 V
Test Quiescent Current (Idq) — 1.2 A
Power Gain (typ) — 18 dB at 1.99 GHz
Operating Class — Class AB, Class C
Gehäuse — TO-270 WB-4 (overmolded plastic, 4-lead)
Montagestil — Surface Mount / Flange Mount
Anzahl der Pins — 5 (per Freescale/NXP datasheet)
Application — CDMA / W-CDMA base station final-stage PA

Datenblätter & Ressourcen

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