MSC8144ETVT800A - SC3400 Core DSP, 800MHz, 783-FCBGA | NXP
Teilenummer: MSC8144ETVT800A ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $268.5 | $2.685,00 |
| 100 | $245.75 | $24.575,00 |
| 500 | $220 | $110.000,00 |
| 1.000 | $195.5 | $195.500,00 |
MSC8144ETVT800A Übersicht
A digital signal processor (DSP) is a specialized microprocessor optimized for numerically intensive real-time operations such as multiply-accumulate (MAC) loops, transform engines, and Viterbi/Turbo decoding. Within the broader semiconductor taxonomy, a DSP belongs to the category of embedded processors > DSP (Digital Signal Processors) > integrated circuit. Compared with general-purpose CPUs, DSPs typically feature wide SIMD datapaths, dedicated memory banks, and tightly coupled DMA controllers, making them suitable for wired and wireless baseband, media transcoding, and radar/sonar processing.
The MSC8144 series integrates four SC3400 StarCore cores running at up to 1 GHz, with each core offering SIMD capabilities for high-throughput DSP workloads. The device integrates 10.5 MB of unified on-chip SRAM, eliminating the need for an external L2 in many designs and reducing memory latency for tight inner-loop kernels. Security features (denoted by the "E" suffix and "T" security accelerator letter in the part number) include encryption and secure boot support.
Voltage requirements are split between a 1.00 V core supply for the SC3400 cores/SRAM and a 3.30 V I/O supply for the external interfaces: Ethernet (UTOPIA), I2C, SPI, TDM, and UART. The wide 32-bit memory subsystem, MAPLE-B baseband accelerator, and DDR2/mDDR memory controller make the part suitable for multi-channel wireless baseband and packet processing.
Typical applications include multi-channel wireless base stations, 3G/4G channel cards, packet processing platforms, voice-over-IP media gateways, and defense signal intelligence workloads. The combination of four high-MHz StarCore cores plus dedicated baseband coprocessors accelerates Turbo, Viterbi, and FFT kernels well beyond what single-core general-purpose DSPs can deliver.
Designers should pay attention to PCB layout requirements for the FCBGA thermal interface, providing a thermal management solution to keep junction temperature within the -40C to +105C operating range. The 1.0 V core and 3.3 V I/O supplies must be sequenced correctly to avoid latch-up. Where latency-sensitive memory accesses dominate, configure DMA channels before enabling the DSP cores.
This page synthesizes distributor pricing, real-time stock, drop-in-compatible variants from the same MSC8144/SC3400 family, and practical layout notes for high-BGA DSP designs, information not found in any single manufacturer datasheet.
Drop-in-Alternativen für MSC8144ETVT800A – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MSC8144ETVT800A (gleiche Bauform und Footprint) – abweichend in Mounting Type, Operating Temperature, Package, Architecture, Interfaces.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MSC8144ETVT1000A
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MSC8156ESAG1000B
✅ Drop-In✓ Auf Lager
$112 / Stück
Datenblatt ansehen →MSC8144ETVT667A
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MSC8144VT800A
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MSC8157SVT1000A
✅ Drop-In✓ Auf Lager
$198.4 / Stück
Datenblatt ansehen →MSC8144ETVT800A Technische Daten
| Core Architecture | SC3400 StarCore (4-core) |
| Number of Cores | 4 |
| Core Clock Rate | 800 MHz |
| On-Chip RAM | 10.5 MB |
| Non-Volatile Memory | External (NOR/NAND boot ROM) |
| Core Voltage | 1.00 V |
| I/O Voltage | 3.30 V |
| Betriebstemperatur | -40C to +105C |
| Operating Temperature Grade | Extended Industrial |
| Montageart | Surface Mount |
| Gehäuse | 783-FCBGA (29x29 mm) |
| Terminal Form | Ball |
| Number of Terminals | 783 |
| Package Code | BGA / FCBGA |
| Package Shape | Square |
| Interfaces | Ethernet (UTOPIA), I2C, SPI, TDM, UART |
| Technology | High-performance multi-core DSP, SIMD |
MSC8144ETVT800A square Pinbelegungsleitfaden
Pinbelegung für MSC8144ETVT800A (square-Gehäuse). Pin-Nummerierung, Funktionen und Anschlussdiagramme sind im Herstellerdatenblatt definiert. Entnehmen Sie diesem den genauen Footprint und Lötrichtlinien.
Keine detaillierten Pinbelegungsdaten verfügbar für MSC8144ETVT800A.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MSC8144ETVT800A ist geeignet für 6 Anwendungs: Multi-Channel Wireless Base Station, Packet Processing / UTOPIA Aggregation, Voice over IP (VoIP) Media Gateway, Defense / Signal Intelligence Workstation, Industrial Motor Control DSP Front-End, Medical Imaging / Ultrasound Beamformer.
Multi-Channel Wireless Base Station
The MSC8144ETVT800A is purpose-built for multi-channel wireless base station baseband processing, where its four SC3400 cores at 800 MHz deliver the raw MAC throughput needed for 3G/4G channel cards. The 10.5 MB on-chip SRAM keeps Turbo, Viterbi, and FFT inner loops on-chip, eliminating the DDR round-trip latency that would otherwise cap channel density. Combined with NXP's MAPLE-B baseband accelerator, it can process multiple UMTS/HSPA carriers per device, reducing BOM cost per channel. Pair the MSC8144 with DDR2 memory, a dedicated RF front-end transceiver, and an Ethernet backhaul interface for a complete baseband card. The -40C to +105C operating range supports outdoor cabinet deployments, and the 1.0 V core / 3.3 V I/O split keeps power within thermal budget of standard base-station cooling.
Empfohlen
Packet Processing / UTOPIA Aggregation
The integrated UTOPIA, I2C, SPI, TDM, and UART interfaces make the MSC8144ETVT800A a strong choice as a packet processing / traffic aggregation engine on telecom line cards. Each SC3400 core can handle class-of-service queuing and traffic shaping at line rate for multiple E1/T1 or Ethernet UTOPIA interfaces - the wide SIMD datapath lets one DSP core sustain hundreds of Mpps of classification work. Hardware encryption acceleration (AES/3DES/SHA via the security accelerator) secures IPSec/TLS tunnels without loading the cores. The 3.3 V I/O voltage and the 783-FCBGA package allow placement on standard telecom backplane line cards alongside legacy interface PHYs.
Empfohlen
Voice over IP (VoIP) Media Gateway
VoIP media gateways require deterministic, low-latency audio codec execution - exactly the workload the MSC8144ETVT800A's SC3400 SIMD cores are designed for. With four 800 MHz cores and 10.5 MB of on-chip SRAM, the device can handle hundreds of simultaneous G.711/G.722/G.729 transcoding sessions without buffer underruns, while the TDM interface accepts T1/E1 PCM streams from the PSTN side. The same cores can run echo cancellation (EC) and DTMF detection in parallel using SIMD lanes. Encryption acceleration offloads SRTP without impacting voice quality. Use the part in compact rack-mount gateways where the 1.0 V core / 3.3 V I/O split keeps overall power-per-channel low.
Empfohlen
Defense / Signal Intelligence Workstation
The wide SIMD datapath, hardware-accelerated encryption, and 10.5 MB on-chip SRAM make the MSC8144ETVT800A well suited for defense signal-intelligence workloads such as wideband demodulation, decoding of proprietary waveforms, and bulk-protocol analysis. The SC3400 cores accelerate FFTs, channelizers, and pattern-matching inner loops, while the security accelerator protects classified code/data with hardware-rooted secure boot. Because the part is specified across -40C to +105C, it tolerates the thermal envelope of ruggedized enclosures. Use a sealed conduction-cooled chassis with a thermal pad on the 783-FCBGA exposed die area for deployable rugged systems.
Empfohlen
Industrial Motor Control DSP Front-End
While most known for telecom workloads, the MSC8144ETVT800A's four SC3400 cores can also act as the real-time front-end for high-end industrial drives, robotics controllers, and CNC machines. Field-oriented control (FOC) loops benefit from the SIMD units' parallel multiply-accumulate capacity, while the 10.5 MB on-chip SRAM eliminates cache-miss jitter that would otherwise lengthen the current-loop period. The robust -40C to +105C industrial temperature grade supports drive cabinets without derating. Pair the DSP with TI or ADI precision ADC/DAC front-ends, low-latency PWM modulators, and isolated gate-driver IGBT/MOSFET bridges.
Empfohlen
Medical Imaging / Ultrasound Beamformer
Ultrasound beamforming and other medical imaging front-ends benefit from the MSC8144ETVT800A's SIMD throughput and large on-chip RAM. Four 800 MHz cores can sustain parallel beam-forming pipelines for tens of physical channels simultaneously, while 10.5 MB of on-chip SRAM holds beam-formed sample lines without external memory round trips, lowering latency to support real-time imaging. Hardware encryption keeps patient data secure at rest. The 3.3 V I/O voltage is compatible with typical medical-grade AFE ADCs. Use a multi-board layout with medical-grade isolation between the DSP board and the patient-connected transducer board.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MSC8144ETVT800A – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MSC8144ETVT1000A | MSC8156ESAG1000B | MSC8144ETVT667A | MSC8144VT800A | MSC8157SVT1000A |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors (Freescale) | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 783-FCBGA (29x29 mm) | 783-FCBGA (29x29 mm) - same | 783-FCBGA (29x29 mm) - same | 783-FCBGA (29x29 mm) - same | 783-FCBGA (29x29 mm) - same | 783-FCBGA (29x29 mm) - same |
| Core Architecture | SC3400 (4-core StarCore) | SC3400 (4-core StarCore) | SC3400 (4-core StarCore) | SC3400 (4-core StarCore) | SC3400 (4-core StarCore) | SC3850 (6-core StarCore) |
| Clock Rate | 800 MHz | 1000 MHz | 1000 MHz | 667 MHz | 800 MHz | 1000 MHz |
Wichtigste Unterscheidungsmerkmale
- Higher CPU frequency headroom via bin-sorted alternative (vs. MSC8144ETVT1000A)
- Sustained baseband throughput with on-chip SRAM (vs. General-purpose CPU + external DRAM)
- Older generation same-family drop-in (vs. MSC8157SVT1000A)
Designhinweise
Estimated: at full SIMD workload across 4 cores at 800 MHz, the MSC8144ETVT800A may dissipate 6-9 W depending on activity factor and the operating frequency of the on-chip accelerators. With a 783-ball FCBGA package offering a finite theta_JA, place a thermal interface material (TIM) under the lid and provide a heat-sink rated for at least 10 W to keep the junction below +105C. Validate with a thermocouple measurement on the lid during burn-in; do not rely on a calculated theta_JA alone for a BGA package.
Escape-route the 783-FCBGA on a high-layer-count board (8+ layers) with a 0.8-1.0 mm ball pitch; group DDR2 signals tightly and length-match to within +/-25 mil. Decouple the 1.0 V core rail with bulk, mid-frequency, and high-frequency ceramic capacitors placed as close as possible to the corresponding balls. The 3.3 V I/O rail may be shared with peripheral ICs but should not be tied directly to a hot-plug connector. Use a reference-clock oscillator within the rise-time budget of the SC3400 input PLL.
Do not skip the boot-mode strapping: the MSC8144ETVT800A latches the boot mode from sampled address lines at reset, so incorrect external resistors will cause silent NAND/SPI flash read failures with no error output. Verify the secure boot signature chain before deploying - enabling hardware security without signing firmware bricks the device. Confirm DDR2/mDDR training is recalibrated for the production PCB stack-up; dev-kit traces typically differ in length from production boards, causing intermittent link errors.
For UTOPIA / Ethernet aggregated traffic, set a clean impedance-controlled link (50 ohm single-ended / 100 ohm differential) to the backplane or PHY. The TDM lines often run multi-MHz clocks - keep them away from the analog audio path on the same PCB. Use series damping resistors on long clock traces if edge rates cause reflections on the TDM bus.
Compliance-Informationen
RoHS / lead-free status not confirmed in retrieved distributor data; contact Rochester Electronics (the licensed distributor on DigiKey) for the latest Material Composition Declaration. AEC-Q100 not applicable - this is an industrial / telecom DSP, not an automotive-grade part.
