MSC8156ESAG1000B vs MSC8157ESVT1000A Vergleich
Detaillierter Direktvergleich von MSC8156ESAG1000B von NXP Semiconductors und MSC8157ESVT1000A von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MSC8156ESAG1000B - 6x SC3850 1GHz DSP SoC | NXP Semiconductors
MSC8156ESAG1000B ✗ AbgekündigtNXP Semiconductors
MSC8157ESVT1000A - 6-Core SC3850 DSP 1GHz FCBGA-783 | NXP
MSC8157ESVT1000A ObsoleteSpezifikationsvergleich
| Parameter | MSC8156ESAG1000B | MSC8157ESVT1000A |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | DSP | DSP |
| Lebenszyklusstatus | Ende des Lebenszyklus | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $112,00 | $152,80 |
| DSP Cores | 6x SC3850 StarCore cores | — |
| Core Clock Frequency | 1 GHz per core | — |
| Aggregate Performance | [DATA_NEEDED: aggregate MMACS rating] | — |
| Process Technology | 45 nm CMOS | CMOS |
| Hardware Accelerator | MAPLE-B baseband accelerator (turbo decode) | — |
| Memory Controller | 64-bit DDR2/DDR3, up to 800 MT/s | Multi-channel DDR SDRAM controller |
| SerDes Lanes | 2 lanes, SRIO or PCIe (selectable) | — |
| Ethernet | 1x Gigabit Ethernet MAC | — |
| Packet Engine | QUICC Engine subsystem | — |
| Security Engine | SEC 4.0 (Cryptographic accelerator) | — |
| Gehäuse | 783-ball FCBGA (29x29 mm) | — |
| Betriebstemperatur | 0C to +105C | 0C to +105C |
| Versorgungsspannung | [DATA_NEEDED: core and I/O rail voltages] | 1.0 V core (typical) |
| Montageart | Surface Mount (BGA) | Surface Mount (FCBGA) |
| RoHS-Status | [DATA_NEEDED: RoHS compliance] | — |
| Lebenszyklusstatus | End of Life (per NXP PCN) | Obsolete (stock available from authorized distributors) |
| Product Type | — | Multi-core Digital Signal Processor (DSP) |
| DSP Core Architecture | — | StarCore SC3850 (Six cores) |
| Core Clock Speed | — | 1 GHz |
| Performance | — | 1000 MIPS per core / 6000 MIPS aggregate |
| Datenbusbreite | — | 32-Bit / 64-Bit |
| L1 Instruction Cache (per core) | — | 32 KB |
| L1 Data Cache (per core) | — | 32 KB |
| Package Type | — | FCBGA-783 (Flip-Chip BGA, 29x29 mm) |
| Pin/Ball Count | — | 783 |
| Lead-Free / RoHS | — | Yes (lead-free) |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL rating] |
| High-Speed Interfaces | — | Serial RapidIO, SGMII, PCI Express, Ethernet, I2C, SPI, UART |