MSC8156ESAG1000B vs MSC8157ESVT1000A Comparación
Comparación detallada lado a lado de MSC8156ESAG1000B por NXP Semiconductors y MSC8157ESVT1000A por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MSC8156ESAG1000B - 6x SC3850 1GHz DSP SoC | NXP Semiconductors
MSC8156ESAG1000B ✗ Fin de vidaNXP Semiconductors
MSC8157ESVT1000A - 6-Core SC3850 DSP 1GHz FCBGA-783 | NXP
MSC8157ESVT1000A ObsoleteComparación de especificaciones
| Parámetro | MSC8156ESAG1000B | MSC8157ESVT1000A |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | DSP | DSP |
| Estado del ciclo de vida | Fin de vida | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $112,00 | $152,80 |
| DSP Cores | 6x SC3850 StarCore cores | — |
| Core Clock Frequency | 1 GHz per core | — |
| Aggregate Performance | [DATA_NEEDED: aggregate MMACS rating] | — |
| Process Technology | 45 nm CMOS | CMOS |
| Hardware Accelerator | MAPLE-B baseband accelerator (turbo decode) | — |
| Memory Controller | 64-bit DDR2/DDR3, up to 800 MT/s | Multi-channel DDR SDRAM controller |
| SerDes Lanes | 2 lanes, SRIO or PCIe (selectable) | — |
| Ethernet | 1x Gigabit Ethernet MAC | — |
| Packet Engine | QUICC Engine subsystem | — |
| Security Engine | SEC 4.0 (Cryptographic accelerator) | — |
| Encapsulado | 783-ball FCBGA (29x29 mm) | — |
| Temperatura de funcionamiento | 0C to +105C | 0C to +105C |
| Tensión de alimentación | [DATA_NEEDED: core and I/O rail voltages] | 1.0 V core (typical) |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount (FCBGA) |
| Estado RoHS | [DATA_NEEDED: RoHS compliance] | — |
| Estado del ciclo de vida | End of Life (per NXP PCN) | Obsolete (stock available from authorized distributors) |
| Product Type | — | Multi-core Digital Signal Processor (DSP) |
| DSP Core Architecture | — | StarCore SC3850 (Six cores) |
| Core Clock Speed | — | 1 GHz |
| Performance | — | 1000 MIPS per core / 6000 MIPS aggregate |
| Ancho del bus de datos | — | 32-Bit / 64-Bit |
| L1 Instruction Cache (per core) | — | 32 KB |
| L1 Data Cache (per core) | — | 32 KB |
| Package Type | — | FCBGA-783 (Flip-Chip BGA, 29x29 mm) |
| Pin/Ball Count | — | 783 |
| Lead-Free / RoHS | — | Yes (lead-free) |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL rating] |
| High-Speed Interfaces | — | Serial RapidIO, SGMII, PCI Express, Ethernet, I2C, SPI, UART |