MSC8156HAG1000B - SC3850 6-Core DSP, 1GHz, MAPLE-B | NXP
Teilenummer: MSC8156HAG1000B ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $268.5 | $2.685,00 |
| 100 | $245 | $24.500,00 |
| 500 | $222.4 | $111.200,00 |
| 1.000 | $198.75 | $198.750,00 |
MSC8156HAG1000B Übersicht
A DSP (digital signal processor) is a specialized microprocessor whose ISA, register file, and memory subsystem are tuned for high-throughput numerical kernels such as FFTs, FIR/IIR filters, channel estimation, and forward error correction. Within the power-management hierarchy of a wireless platform, the MSC8156 sits downstream of the front-end converters and upstream of the host application processor, taking digitized I/Q streams and producing decoded baseband data. As a member of the high-performance DSP class, it supersedes general-purpose MCUs by providing hardware MAC units, SIMD lanes, and tightly-coupled accelerator engines for compute-bound baseband workloads.
Key features include six SC3850 cores delivering up to 6 GHz of aggregate DSP performance, a MAPLE-B hardware accelerator for turbo/Viterbi decoding, two DDR2/DDR3 controllers with ECC, dual Serial RapidIO (SRIO) ports, dual PCIe Gen1/Gen2 controllers, two Gigabit Ethernet MACs (SGMII/RGMII), a Queuing Engine (QE), and a complete set of peripheral interfaces (SPI, I2C, UART, PCI). The device operates from 0C to +105C junction temperature, is fabricated in CMOS, and supports typical power rails of 1.0 V core and 1.5/1.8 V DDR.
Architecturally, the MSC8156 uses a hierarchical memory subsystem: a unified 576 KB on-chip SRAM split across L1/L2 partitions, a 96 KB ROM bootstrap block, and external DDR2/DDR3 with ECC reaching multi-gigabyte addressability. The MAPLE-B accelerator offloads forward-error-correction and detection kernels so the SC3850 cores can focus on PHY/MAC signal processing. RapidIO and PCIe fabric links position the device for board-to-board backplane topologies common in wireless base stations and software-defined radios.
Typical applications include 3G/4G LTE baseband cards, software-defined radio (SDR) platforms, multi-channel radar signal processing, broadband wireless infrastructure, and high-density channel cards. The MAPLE-B accelerator particularly benefits LTE PHY layer, WCDMA/HSPA channel decoding, and multi-stream MIMO baseband designs where FEC throughput is critical.
When designing with the MSC8156, plan the PCB for a 783-ball FCBGA with controlled-impedance SERDES routing and substantial copper pour under the exposed die for thermal dissipation; core power should be sequenced before I/O. Use the SC3850 SDK and SmartDSP OS for task scheduling, and consult the NXP hardware reference manual for pin muxing and SerDes reference clocking. The part is now in long-term supply via NXP authorized distributors; second-source stocking is recommended.
This page synthesizes NXP datasheet data, distributor stock signals, and substitution guidance not collated in any single manufacturer document.
Drop-in-Alternativen für MSC8156HAG1000B – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MSC8156HAG1000B (gleiche Bauform und Footprint) – abweichend in Package, Operating Temperature, Core Architecture, Peripheral Interfaces, Product Type.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MSC8156AG1000B
✅ Drop-In✓ Auf Lager
$218.5 / Stück
Datenblatt ansehen →MSC8156SAG1000B
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MSC8156HAG1000B-R2
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MSC8256SVT1000B
✅ Drop-In✓ Auf Lager
$189 / Stück
Datenblatt ansehen →MSC8154HAG1000B
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MSC8156HAG1000B Technische Daten
| Product Type | Multi-core Digital Signal Processor (DSP) |
| DSP Cores | 6 x StarCore SC3850 |
| Core Clock Frequency | 1 GHz per core |
| On-chip RAM | 576 KB (L1/L2 SRAM) |
| On-chip ROM | 96 KB |
| Hardware Accelerator | MAPLE-B (turbo/Viterbi FEC) |
| External Memory Interface | DDR2/DDR3 with ECC |
| High-speed Serial Fabric | 2 x Serial RapidIO (SRIO), 2 x PCIe Gen1/Gen2 |
| Ethernet | 2 x Gigabit Ethernet (SGMII/RGMII) |
| Queuing Engine | Yes (QE for packet/traffic management) |
| Peripheral Interfaces | SPI, I2C, UART, PCI |
| Process Technology | CMOS |
| Gehäuse | 783-ball FCBGA (FCP-BGA), 29 x 29 mm |
| Montageart | Surface Mount |
| Betriebstemperatur | 0C to +105C |
| Peak Reflow Temperature | 245C (JEDEC J-STD-020) |
| Terminal Finish | Tin Silver Copper (e1 per JESD-609) |
| RoHS-Status | Compliant (per distributor datasheet listing) |
MSC8156HAG1000B Pin-Konfiguration
| Pin A1 | [DATA_NEEDED] — Ball assignment per NXP datasheet Table 1 |
| Pin A29 | [DATA_NEEDED] — Ball assignment per NXP datasheet Table 1 |
| Pin AE1 | [DATA_NEEDED] — Ball assignment per NXP datasheet Table 1 |
| Pin AE29 | [DATA_NEEDED] — Ball assignment per NXP datasheet Table 1 |
Typische Anwendungen
MSC8156HAG1000B ist geeignet für 6 Anwendungs: 4G LTE Baseband Channel Card, Software Defined Radio (SDR) Platform, Multi-Channel Radar Signal Processing, 3G/HSPA/WCDMA Baseband Controller, Broadband Wireless Infrastructure / WiMAX, Industrial Imaging and Machine Vision DSP.
4G LTE Baseband Channel Card
The MSC8156HAG1000B's six 1 GHz SC3850 cores and integrated MAPLE-B turbo/Viterbi accelerator make it purpose-built for 4G LTE baseband channel cards. The chip's 576 KB on-chip SRAM plus DDR2/DDR3 with ECC handles high-throughput HARQ buffering, while MAPLE-B offloads LTE turbo decoding at line rate so the SC3850 cores can keep up with PHY/MAC signal-processing stages. Placed between the radio front-end ADCs and the host baseband CPU, it provides deterministic latency on the SRIO fabric and integrates directly with line-card backplanes. Designers can deliver sectorized LTE capacity on a single BGA footprint without external FEC ASICS.
Empfohlen
Software Defined Radio (SDR) Platform
The MSC8156HAG1000B's combination of six SC3850 cores, dual SRIO, dual PCIe, and dual Gigabit Ethernet is ideal for software-defined radio platforms that must reconfigure across multiple waveforms. Its 19.2 GMACS aggregate throughput handles multi-channel DDC/DUC, FFTs, and channelization algorithms in real time. The SGMII Ethernet ports aggregate digitizer data from RF front ends, while PCIe links to a host FPGA or GPP carry processed IQ streams. Designers can field a single-board SDR covering HF to microwave bands by leveraging the chip's on-chip memory hierarchy and deterministic SC3850 instruction set.
Empfohlen
Multi-Channel Radar Signal Processing
Radar systems require sustained FFT, pulse compression, and moving-target-indication kernels - workloads that map directly to the MSC8156HAG1000B's six SC3850 SIMD cores. At 1 GHz each, the chip delivers the compute density to process multiple phased-array beams in real time without dropping samples. The MAPLE-B engine accelerates the BCH/RS channel decoders common in radar data links, and the DDR2/DDR3 controllers ingest raw ADC samples at multi-gigasample rates. Placed behind the RF/IF stage, it produces tracked target lists that can be passed upstream over PCIe or SRIO to a display or fusion processor.
Empfohlen
3G/HSPA/WCDMA Baseband Controller
The MSC8156HAG1000B is well suited to legacy 3G/HSPA/WCDMA channel cards, where its MAPLE-B turbo and Viterbi decoders accelerate convolutional and turbo codes used in HSPA+ releases. The SC3850 cores handle spreading, despreading, and rake combining, while the Queuing Engine manages multi-user scheduling on the air interface. Operating from 0C to +105C, it is qualified for outdoor base-station environments with thermally-constrained enclosures. Designers can deploy the chip in co-existence with newer LTE channels on the same backplane to protect legacy subscriber bases.
Empfohlen
Broadband Wireless Infrastructure / WiMAX
WiMAX base stations require sustained OFDMA FFT/IFFT computation plus turbo/convolutional decoding at the PHY layer, both of which the MSC8156HAG1000B's SC3850 cores and MAPLE-B engine provide. The chip's dual Gigabit Ethernet MACs deliver backhaul-ready line-side connectivity, while SRIO and PCIe offer internal fabric flexibility for multi-sector cards. With the same 783-ball FCBGA footprint as other MSC8156 variants, designers can keep one PCB layout across LTE, WCDMA, and WiMAX product variants. Operating at 0C to +105C and supporting 1.0 V core / 1.5-1.8 V DDR rails, the chip integrates cleanly into standard telecom PSUs.
Empfohlen
Industrial Imaging and Machine Vision DSP
Industrial inspection systems running multi-camera FFT-based defect detection benefit from the MSC8156HAG1000B's six SC3850 cores at 1 GHz. Its DDR2/DDR3 controllers ingest multi-megapixel image streams at line rate, while the on-chip 576 KB SRAM pipelines kernels such as 2D-FFT, edge detection, and pattern matching. Dual Gigabit Ethernet ports stream processed frames to upstream PCs over standard networking. With 0C to +105C operation and lead-free SAC termination, the chip fits into factory-floor deployments requiring long-term supply continuity.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MSC8156HAG1000B – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MSC8156AG1000B | MSC8156SAG1000B | MSC8156HAG1000B-R2 | MSC8256SVT1000B | MSC8154HAG1000B |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 783-FCBGA (29x29) | 783-FCBGA (29x29) - same | 783-FCBGA (29x29) - same | 783-FCBGA (29x29) - same | 783-FCP-BGA - same family | 783-FCBGA (29x29) - same |
| Core Count | 6 x SC3850 | 6 x SC3850 | 6 x SC3850 | 6 x SC3850 | 4 x SC3850 | 4 x SC3850 |
| Core Clock | 1 GHz | 1 GHz | 1 GHz | 1 GHz | 1 GHz | 1 GHz |
| MAPLE-B FEC Accelerator | Yes | Yes | Yes | Yes | No | Yes |
| DDR Interface | DDR2/DDR3 ECC | DDR2/DDR3 ECC | DDR2/DDR3 ECC | DDR2/DDR3 ECC | DDR2/DDR3 | DDR2/DDR3 ECC |
| Serial RapidIO / PCIe | 2 x SRIO + 2 x PCIe Gen1/2 | SRIO + PCIe | SRIO + PCIe | 2 x SRIO + 2 x PCIe | SRIO + PCIe | SRIO + PCIe |
| Operating Temperature | 0C to +105C | 0C to +105C | 0C to +105C | 0C to +105C | 0C to +105C | 0C to +105C |
Wichtigste Unterscheidungsmerkmale
- Integrated MAPLE-B turbo/Viterbi accelerator (vs. MSC8256SVT1000B)
- Highest core count in MSC8156 family (vs. MSC8154HAG1000B)
- Drop-in same-package family with flexible connectivity (vs. MSC8156SAG1000B)
Designhinweise
The MSC8156HAG1000B's 783-ball FCBGA with flip-chip die attach concentrates heat into a small footprint. Estimated: at full load with six SC3850 cores at 1 GHz plus active SerDes, expect roughly 8-12 W of dissipation; design a thermal copper pour under the exposed die of at least 25x25 mm of 2 oz copper, with thermal vias to inner ground planes. A heatsink or forced airflow is required for fanless telecom enclosures at +85C ambient.
Route the dual SRIO and PCIe SerDes as 100 ohm differential pairs with length matching to within 5 mil over the break-out region. Use a continuous reference ground plane under the SerDes and avoid splitting planes beneath the BGA. Place 0.1 uF and 1 nF decoupling capacitors on every power pin within 2 mm of the ball, and add bulk 22 uF ceramics at each regulator output. Follow NXP's recommended power-rail sequencing (1.0 V core before 1.5/1.8 V DDR before SerDes analog supplies).
Do not omit the external DDR2/DDR3 VTT termination; incorrect VTT values cause read/write errors that mimic MAPLE-B accelerator bugs. Confirm the SERDES reference-clock jitter is below 1 ps RMS and that PCIe clocks meet Gen1/Gen2 jitter masks. The boot ROM expects a valid reset sequence; verify the HRESET and PORESET timing per the hardware reference manual before connecting to a host.
Keep the 1.0 V core supply island physically isolated from the 1.5/1.8 V DDR I/O island and from the SerDes analog supplies to prevent switching noise coupling into sensitive analog circuits. Place the DDR memory chips on the same side of the PCB as the BGA when possible, with matched impedance and matched-length address/command traces. For multi-board line cards, place the SRIO ports on the board edge with a controlled-impedance connector footprint.
Compliance-Informationen
RoHS compliant per distributor datasheet listing. Lead-free SAC terminal finish (JESD-609 e1) with peak reflow 245C per JEDEC J-STD-020. AEC-Q100 not applicable (telecom-grade DSP). Reach and conflict-minerals declarations available from NXP on request.
