MSC8157TVT1000A vs MSC8154ETVT1000B Vergleich

Detaillierter Direktvergleich von MSC8157TVT1000A von NXP Semiconductors und MSC8154ETVT1000B von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MSC8157TVT1000A MSC8157TVT1000A - 6-Core SC3850 DSP 1GHz 783-FCBGA | NXP

MSC8157TVT1000A - 6-Core SC3850 DSP 1GHz 783-FCBGA | NXP

MSC8157TVT1000A Obsolete
NXP Semiconductors
MSC8154ETVT1000B MSC8154ETVT1000B - Quad-Core SC3850 DSP 1GHz FCBGA-783 | NXP

MSC8154ETVT1000B - Quad-Core SC3850 DSP 1GHz FCBGA-783 | NXP

MSC8154ETVT1000B Obsolete

Spezifikationsvergleich

Parameter MSC8157TVT1000A MSC8154ETVT1000B
Marke NXP Semiconductors NXP Semiconductors
Kategorie DSP DSP
Lebenszyklusstatus Obsolete Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $171,00 $171,00
Series StarCore —
Type SC3850 Six-Core Digital Signal Processor —
Datenbusbreite 32-Bit / 64-Bit —
Core Architecture StarCore SC3850 StarCore SC3850 (quad-core)
Number of Cores 6 4
Clock Rate 1 GHz —
Performance 1000 MIPS per core (up to 6000 MIPS aggregate) 1000 MIPS per core (4000 MIPS aggregate)
Package Type FCBGA-783 (29 mm x 29 mm) —
Pin-Anzahl 783 —
Montageart Surface Mount (BGA) —
Betriebstemperatur -40 C to +105 C —
Voltage - Core (Vccint) 1.0 V —
Voltage - I/O 1.0 V / 1.5 V / 2.5 V —
On-Chip RAM 6.375 MB 576 KB
Non-Volatile Memory (ROM) 96 kB —
Interfaces Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART —
Memory Controller DDR2 / DDR3 (32-bit / 64-bit) —
RoHS-Status Lead-free (per FCBGA marking) Compliant
Status Obsolete (EOL) —
Core Clock Frequency — 1 GHz
L1 Instruction Cache — 32 KB per core
L1 Data Cache — 32 KB per core
L2 Unified Cache — 512 KB
On-Chip ROM — 96 KB
External Memory Interface — DDR2/DDR3 controller
High-Speed Serial Interfaces — Serial RapidIO, PCI Express
Ethernet Interfaces — 2x RGMII Gigabit Ethernet MACs
Peripheral Interfaces — I2C, SPI, UART, TDM
Security Engine — Integrated (IPSec, Kasumi, Snow 3G)
Gehäuse — 783-FCPBGA (29x29 mm)
Operating Temperature Grade — Industrial

Datenblätter & Ressourcen

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