MSC8251SVT1000B vs MSC8256ESAG1000B Vergleich

Detaillierter Direktvergleich von MSC8251SVT1000B von NXP Semiconductors und MSC8256ESAG1000B von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MSC8251SVT1000B MSC8251SVT1000B - SC3850 DSP 1GHz 783-FCBGA | NXP

MSC8251SVT1000B - SC3850 DSP 1GHz 783-FCBGA | NXP

MSC8251SVT1000B Obsolete
NXP Semiconductors
MSC8256ESAG1000B MSC8256ESAG1000B - 6x 1GHz SC3850 StarCore DSP | NXP

MSC8256ESAG1000B - 6x 1GHz SC3850 StarCore DSP | NXP

MSC8256ESAG1000B ⚠ Letzte Bestellmöglichkeit

Spezifikationsvergleich

Parameter MSC8251SVT1000B MSC8256ESAG1000B
Marke NXP Semiconductors NXP Semiconductors
Kategorie DSP DSP
Lebenszyklusstatus Obsolete Letzte Kaufgelegenheit
Lagerstatus In Stock In Stock
Stückpreis (USD) $65,00 $198,75
Manufacturer NXP Semiconductors (formerly Freescale Semiconductor) —
Core Architecture SC3850 StarCore, single core StarCore SC3850 VLIW DSP
Core Revision StarCore R2.1 —
Maximum Core Clock 1 GHz —
MIPS [DATA_NEEDED: MIPS rating for 1 GHz SC3850] —
L1 Instruction Cache 32 KB —
L1 Data Cache 32 KB —
L2 Unified Cache 512 KB (configurable, SRAM or MAP) —
On-Chip RAM 576 KB —
Internal ROM 96 KB —
TDM Interfaces 4 modules, up to 62.5 Mbps each, with H.110/H-MVIP support —
Ethernet MAC Yes (integrated) —
PCI Express Yes (integrated controller) PCIe (peripheral)
Serial RapidIO Yes (SERDES-based) SRIO (peripheral)
DMA Controller Multi-channel DMA —
Package Type FCBGA (Flip-Chip Ball Grid Array) —
Package Pin Count 783 balls —
Package Dimensions 29 mm x 29 mm —
Montageart Surface Mount Surface Mount, BGA
Lead-Free / Halogen-Free Yes (lead-free, halogen-free package) —
RoHS-Status Compliant Compliant
Betriebstemperatur [DATA_NEEDED: operating temperature grade] 0°C to 105°C
Number of Cores — 6
Core Frequency — 1 GHz
DDR Memory Interface — DDR2/DDR3 with ECC
Gigabit Ethernet — GbE MACs (peripheral)
Security Engine — SEC (IPsec/SRTP/SSL)
Queue Engine — QE (peripheral)
Gehäuse — 783-FCPBGA (29x29 mm)
MSL-Level — 3
Peak Reflow Temperature — 245°C (JEDEC J-STD-020)
Terminal Finish — Tin Silver Copper (e1, JESD-609)
TDM Links — Up to 4 independent, 62.5 Mbps each

Datenblätter & Ressourcen

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