MSC8251SVT1000B vs MSC8256ESAG1000B 对比

详细并排对比 MSC8251SVT1000B 出自 NXP Semiconductors 和 MSC8256ESAG1000B 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
MSC8251SVT1000B MSC8251SVT1000B - SC3850 DSP 1GHz 783-FCBGA | NXP

MSC8251SVT1000B - SC3850 DSP 1GHz 783-FCBGA | NXP

MSC8251SVT1000B Obsolete
NXP Semiconductors
MSC8256ESAG1000B MSC8256ESAG1000B - 6x 1GHz SC3850 StarCore DSP | NXP

MSC8256ESAG1000B - 6x 1GHz SC3850 StarCore DSP | NXP

MSC8256ESAG1000B ⚠ 最后一次采购

规格对比

参数 MSC8251SVT1000B MSC8256ESAG1000B
品牌 NXP Semiconductors NXP Semiconductors
分类 DSP DSP
生命周期状态 Obsolete 最后采购期
库存状态 有库存 有库存
单价(USD) $65.00 $198.75
Manufacturer NXP Semiconductors (formerly Freescale Semiconductor) —
Core Architecture SC3850 StarCore, single core StarCore SC3850 VLIW DSP
Core Revision StarCore R2.1 —
Maximum Core Clock 1 GHz —
MIPS [DATA_NEEDED: MIPS rating for 1 GHz SC3850] —
L1 Instruction Cache 32 KB —
L1 Data Cache 32 KB —
L2 Unified Cache 512 KB (configurable, SRAM or MAP) —
On-Chip RAM 576 KB —
Internal ROM 96 KB —
TDM Interfaces 4 modules, up to 62.5 Mbps each, with H.110/H-MVIP support —
Ethernet MAC Yes (integrated) —
PCI Express Yes (integrated controller) PCIe (peripheral)
Serial RapidIO Yes (SERDES-based) SRIO (peripheral)
DMA Controller Multi-channel DMA —
Package Type FCBGA (Flip-Chip Ball Grid Array) —
Package Pin Count 783 balls —
Package Dimensions 29 mm x 29 mm —
安装类型 Surface Mount Surface Mount, BGA
Lead-Free / Halogen-Free Yes (lead-free, halogen-free package) —
RoHS 状态 Compliant Compliant
工作温度 [DATA_NEEDED: operating temperature grade] 0°C to 105°C
Number of Cores — 6
Core Frequency — 1 GHz
DDR Memory Interface — DDR2/DDR3 with ECC
Gigabit Ethernet — GbE MACs (peripheral)
Security Engine — SEC (IPsec/SRTP/SSL)
Queue Engine — QE (peripheral)
封装 — 783-FCPBGA (29x29 mm)
MSL 等级 — 3
Peak Reflow Temperature — 245°C (JEDEC J-STD-020)
Terminal Finish — Tin Silver Copper (e1, JESD-609)
TDM Links — Up to 4 independent, 62.5 Mbps each

数据手册与资源

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