MSC8251SVT1000B vs MSC8256ESAG1000B Comparaison
Comparaison détaillée côte à côte de MSC8251SVT1000B par NXP Semiconductors et MSC8256ESAG1000B par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
MSC8256ESAG1000B - 6x 1GHz SC3850 StarCore DSP | NXP
MSC8256ESAG1000B ⚠ Dernier achatComparaison des spécifications
| Paramètre | MSC8251SVT1000B | MSC8256ESAG1000B |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | DSP | DSP |
| Statut du cycle de vie | Obsolete | Dernier achat |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $65,00 | $198,75 |
| Manufacturer | NXP Semiconductors (formerly Freescale Semiconductor) | — |
| Core Architecture | SC3850 StarCore, single core | StarCore SC3850 VLIW DSP |
| Core Revision | StarCore R2.1 | — |
| Maximum Core Clock | 1 GHz | — |
| MIPS | [DATA_NEEDED: MIPS rating for 1 GHz SC3850] | — |
| L1 Instruction Cache | 32 KB | — |
| L1 Data Cache | 32 KB | — |
| L2 Unified Cache | 512 KB (configurable, SRAM or MAP) | — |
| On-Chip RAM | 576 KB | — |
| Internal ROM | 96 KB | — |
| TDM Interfaces | 4 modules, up to 62.5 Mbps each, with H.110/H-MVIP support | — |
| Ethernet MAC | Yes (integrated) | — |
| PCI Express | Yes (integrated controller) | PCIe (peripheral) |
| Serial RapidIO | Yes (SERDES-based) | SRIO (peripheral) |
| DMA Controller | Multi-channel DMA | — |
| Package Type | FCBGA (Flip-Chip Ball Grid Array) | — |
| Package Pin Count | 783 balls | — |
| Package Dimensions | 29 mm x 29 mm | — |
| Type de montage | Surface Mount | Surface Mount, BGA |
| Lead-Free / Halogen-Free | Yes (lead-free, halogen-free package) | — |
| Statut RoHS | Compliant | Compliant |
| Température de fonctionnement | [DATA_NEEDED: operating temperature grade] | 0°C to 105°C |
| Number of Cores | — | 6 |
| Core Frequency | — | 1 GHz |
| DDR Memory Interface | — | DDR2/DDR3 with ECC |
| Gigabit Ethernet | — | GbE MACs (peripheral) |
| Security Engine | — | SEC (IPsec/SRTP/SSL) |
| Queue Engine | — | QE (peripheral) |
| Boîtier | — | 783-FCPBGA (29x29 mm) |
| Niveau MSL | — | 3 |
| Peak Reflow Temperature | — | 245°C (JEDEC J-STD-020) |
| Terminal Finish | — | Tin Silver Copper (e1, JESD-609) |
| TDM Links | — | Up to 4 independent, 62.5 Mbps each |