P1012NSN2HFB vs P1012NSE2HFB Vergleich
Detaillierter Direktvergleich von P1012NSN2HFB von NXP Semiconductors und P1012NSE2HFB von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
P1012NSN2HFB - QorIQ P1012 800MHz e500v2 MPU | NXP | Networking
P1012NSN2HFB ⚠ Letzte BestellmöglichkeitNXP Semiconductors
P1012NSE2HFB - QorIQ P1 800MHz e500v2 SoC MPU | NXP
P1012NSE2HFB ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | P1012NSN2HFB | P1012NSE2HFB |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Letzte Kaufgelegenheit | Letzte Kaufgelegenheit |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $49,85 | $52,75 |
| Manufacturer | NXP Semiconductors | — |
| Series | QorIQ P1 | — |
| Core Processor | PowerPC e500v2 | — |
| Number of Cores | 1 | 1 |
| Core Architecture | 32-bit | 32-Bit Power Architecture |
| Speed | 800 MHz | — |
| Co-processors / DSP | QUICC Engine (QE) | — |
| Connectivity | Ethernet, PCIe, USB, TDM, UART, I2C, SPI | — |
| Ethernet | GbE (10/100/1000 Mbps) | Integrated GbE (multiple MACs) |
| Memory Controller | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC |
| USB | USB 2.0 (dual port) | USB 2.0 (host + device) |
| PCIe | PCIe Gen1 (x1/x2) | — |
| Process Technology | 45 nm | 45 nm CMOS |
| Gehäuse / Bauform | 689-TEPBGA II (31x31 mm) with exposed thermal pad | — |
| Montageart | Surface Mount | Surface Mount |
| Betriebstemperatur | 0 C to 125 C | — |
| Packaging | Tray | Tray |
| Lead Free Status | Lead Free | Lead Free |
| RoHS-Status | RoHS Compliant | RoHS Compliant |
| Die Revision | 1.1 | — |
| Security | Hardware-accelerated cryptography | — |
| Processor Series | — | QorIQ P1 |
| Processor Core | — | PowerPC e500v2 |
| Maximum Core Frequency | — | 800 MHz |
| PCIe Controllers | — | PCIe Gen 2 (x1/x2/x4) |
| TDM Interfaces | — | 4 (T1/E1) |
| QUICC Engine (QE) | — | Yes (protocol offload) |
| SEC Security Accelerator | — | SEC 4.0 |
| Gehäuse | — | 689-TEPBGA II (31x31 mm) with exposed thermal pad |
| Operating Temperature (Tj) | — | 0C to +125C |