P1012NSN2HFB vs P1012NSE2HFB 对比

详细并排对比 P1012NSN2HFB 出自 NXP Semiconductors 和 P1012NSE2HFB 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
P1012NSN2HFB P1012NSN2HFB - QorIQ P1012 800MHz e500v2 MPU | NXP | Networking

P1012NSN2HFB - QorIQ P1012 800MHz e500v2 MPU | NXP | Networking

P1012NSN2HFB ⚠ 最后一次采购
NXP Semiconductors
P1012NSE2HFB P1012NSE2HFB - QorIQ P1 800MHz e500v2 SoC MPU | NXP

P1012NSE2HFB - QorIQ P1 800MHz e500v2 SoC MPU | NXP

P1012NSE2HFB ⚠ 最后一次采购

规格对比

参数 P1012NSN2HFB P1012NSE2HFB
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 最后采购期 最后采购期
库存状态 有库存 有库存
单价(USD) $49.85 $52.75
Manufacturer NXP Semiconductors —
Series QorIQ P1 —
Core Processor PowerPC e500v2 —
Number of Cores 1 1
Core Architecture 32-bit 32-Bit Power Architecture
Speed 800 MHz —
Co-processors / DSP QUICC Engine (QE) —
Connectivity Ethernet, PCIe, USB, TDM, UART, I2C, SPI —
Ethernet GbE (10/100/1000 Mbps) Integrated GbE (multiple MACs)
Memory Controller DDR2/DDR3 with ECC DDR2/DDR3 with ECC
USB USB 2.0 (dual port) USB 2.0 (host + device)
PCIe PCIe Gen1 (x1/x2) —
Process Technology 45 nm 45 nm CMOS
封装 / 外壳 689-TEPBGA II (31x31 mm) with exposed thermal pad —
安装类型 Surface Mount Surface Mount
工作温度 0 C to 125 C —
Packaging Tray Tray
Lead Free Status Lead Free Lead Free
RoHS 状态 RoHS Compliant RoHS Compliant
Die Revision 1.1 —
Security Hardware-accelerated cryptography —
Processor Series — QorIQ P1
Processor Core — PowerPC e500v2
Maximum Core Frequency — 800 MHz
PCIe Controllers — PCIe Gen 2 (x1/x2/x4)
TDM Interfaces — 4 (T1/E1)
QUICC Engine (QE) — Yes (protocol offload)
SEC Security Accelerator — SEC 4.0
封装 — 689-TEPBGA II (31x31 mm) with exposed thermal pad
Operating Temperature (Tj) — 0C to +125C

数据手册与资源

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