PK30N512VMD100 vs MK60DN512ZVMD10 Vergleich

Detaillierter Direktvergleich von PK30N512VMD100 von NXP Semiconductors und MK60DN512ZVMD10 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
PK30N512VMD100 PK30N512VMD100 - 100MHz Cortex-M4 512KB MCU | NXP

PK30N512VMD100 - 100MHz Cortex-M4 512KB MCU | NXP

PK30N512VMD100 Obsolete

Spezifikationsvergleich

Parameter PK30N512VMD100 MK60DN512ZVMD10
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus Obsolete NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $0,00 $14,81
Product Type 32-bit ARM Cortex-M4 microcontroller —
Series Kinetis K30 —
Processor Core ARM Cortex-M4 —
Core Width 32-bit —
Maximum Clock Speed 100 MHz —
Program Memory Size 512 KB (512K x 8) —
RAM Size 128K x 8 —
Number of I/O 102 —
Gehäuse 144-MAPBGA (13 x 13 mm) 144-pin MAP-BGA (13 x 13 mm, 0.8 mm pitch)
Package Type MAPBGA —
Operating Supply Options 1.8 V, 2.5 V, 3.3 V —
Connectivity CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART —
Peripherals DMA, I2S, LCD, LVD, POR, PWM, WDT —
Oscillator Type Internal —
Packaging Tray —
Ambient Temperature Upper Limit 105 °C —
Lebenszyklusstatus Obsolete —
Supplier Qualification Note Pre-qual sample —
RoHS [DATA_NEEDED: RoHS status] —
REACH [DATA_NEEDED: REACH status] —
AEC-Q100 Qualification [DATA_NEEDED: AEC-Q100 qualification] —
Core Architecture — ARM Cortex-M4 with FPU and DSP instructions
Maximum CPU Frequency — 100 MHz
Program Flash Memory — 512 KB (512K x 8)
SRAM — 128 KB
Supply Voltage Range — 1.71 V to 3.6 V
Betriebstemperaturbereich — -40C to +105C (industrial extended)
Ethernet MAC — 10/100 Mbps with IEEE 1588 timestamping
USB — USB 2.0 Full-Speed OTG with on-chip transceiver
Hardware Cryptography — AES, DES, 3DES, MD5, SHA-1, SHA-256, TRNG
ADC — Dual 16-bit SAR, up to 4 Msps
DAC — 12-bit
CAN — FlexCAN (CAN 2.0B)
GPIO — Up to 100 (multiplexed)
External Memory Bus — 16-bit, supports SDRAM and NAND/NOR Flash
Low-Power Modes — Wait, Stop, VLPR, VLPW, VLLS
Montageart — Surface Mount (BGA)
MSL-Level — 3 (per JEDEC J-STD-020)
RoHS-Status — Compliant

Datenblätter & Ressourcen

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