PK30N512VMD100 - 100MHz Cortex-M4 512KB MCU | NXP
Teilenummer: PK30N512VMD100 ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1.000 | $0 | $0,00 |
PK30N512VMD100 Übersicht
A microcontroller is a programmable system-on-chip that combines a processor core, nonvolatile program memory, volatile data memory, and peripheral interfaces on one semiconductor device. The PK30N512VMD100 belongs to the Kinetis K30 family and sits within the hierarchy of ARM Cortex-M4 embedded processor, 32-bit microcontroller, embedded systems controller, and semiconductor. Its combination of memory and communication peripherals supports compact control systems that must handle both control logic and external serial devices.
Verified device features include a 100 MHz clock, 512 KB Flash organized as 512K x 8, 128K x 8 RAM, and 102 I/O pins. Listed connectivity includes CANbus, EBI/EMI, I2C, IrDA, SD, SPI, and UART/USART. Listed peripherals include DMA, I2S, an LCD controller, low-voltage detection, power-on reset, PWM, and a watchdog timer. These interfaces make the MCU applicable to industrial control, communications, display-oriented embedded equipment, audio data handling, and motor or power-control systems.
The part is identified in the supplied source material as obsolete, and one distributor listing describes it as a pre-qualification sample. Its K30 architecture therefore requires lifecycle attention during design selection: existing supported designs should confirm sourcing and qualification, while new designs should avoid committing to an obsolete MCU unless long-term availability is independently secured. The 144-MAPBGA package also demands BGA assembly capability, careful escape-routing planning, and adequate thermal design.
Typical implementation places the MCU between sensors, communication transceivers, display peripherals, actuators, and external memory. Firmware must configure clocks and peripherals, while the board must provide regulated supply rails, decoupling, reset handling, clock stability, and programming/debug access. The supplied sources do not provide a complete verified pinout, electrical limits, or a full set of operating ranges.
For a new board, do not infer pin compatibility from the 144-BGA package name alone. Compare every ball assignment, power domain, peripheral mapping, voltage limit, and software device configuration against the manufacturer documentation. The listed alternative comparison results identify functionally related devices but do not establish true pin-to-pin drop-in replacements.
This page consolidates distributor specifications, lifecycle indications, interface details, package information, and engineering cautions into a design-oriented reference for the PK30N512VMD100. It is intended to support sourcing, legacy maintenance, and feasibility review without inventing electrical values absent from the verified data.
Drop-in-Alternativen für PK30N512VMD100 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit PK30N512VMD100 (gleiche Bauform und Footprint) – abweichend in Package, Core Architecture, Series, Mounting Type, Maximum CPU Frequency.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MK60DN512ZVMD10
✅ Drop-In✓ Auf Lager
$14.81 / Stück
Datenblatt ansehen →MK10DN512ZAB10R
✅ Drop-In✓ Auf Lager
$5.73 / Stück
Datenblatt ansehen →MK21FX512VMD12
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →MK51DN512ZCLQ10
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →MK50DN512CLQ10
✅ Drop-In✓ Auf Lager
$10.21 / Stück
Datenblatt ansehen →PK30N512VMD100 Grenzwerte & elektrische Eigenschaften
| Product Type | 32-bit ARM Cortex-M4 microcontroller |
| Series | Kinetis K30 |
| Processor Core | ARM Cortex-M4 |
| Core Width | 32-bit |
| Maximum Clock Speed | 100 MHz |
| Program Memory Size | 512 KB (512K x 8) |
| RAM Size | 128K x 8 |
| Number of I/O | 102 |
| Gehäuse | 144-MAPBGA (13 x 13 mm) |
| Package Type | MAPBGA |
| Operating Supply Options | 1.8 V, 2.5 V, 3.3 V |
| Connectivity | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART |
| Peripherals | DMA, I2S, LCD, LVD, POR, PWM, WDT |
| Oscillator Type | Internal |
| Packaging | Tray |
| Ambient Temperature Upper Limit | 105 °C |
| Lebenszyklusstatus | Obsolete |
| Supplier Qualification Note | Pre-qual sample |
PK30N512VMD100 mapbga Pinbelegungsleitfaden
Pinbelegung für PK30N512VMD100 (mapbga-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für PK30N512VMD100.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
PK30N512VMD100 ist geeignet für 6 Anwendungs: Industrial Controller, CAN Networked Equipment, Human-Machine Interface Controller, Serial Gateway, Motor and Power Control, Audio Data Controller.
Industrial Controller
The PK30N512VMD100 fits a legacy industrial-control design requiring a 100 MHz ARM Cortex-M4 core, 512 KB Flash, 128K x 8 RAM, and 102 I/O connections. Its listed CANbus, UART/USART, SPI, I2C, EBI/EMI, DMA, PWM, and watchdog resources support sensor acquisition, actuator control, and supervisory communications. The device should be used only when exact software and package continuity justify obsolete sourcing. Because electrical limits and thermal data are not in the verified records, supply regulation and thermal design require manufacturer documentation.
Empfohlen
CAN Networked Equipment
For a legacy CAN-based controller, the PK30N512VMD100 provides a 100 MHz Cortex-M4 processor and verified CANbus connectivity alongside DMA, PWM, and watchdog functions. That combination can coordinate remote sensor nodes, motor commands, diagnostics, and host serial traffic without a separate protocol processor. Firmware must define message identifiers, timing, fault handling, and bus-off recovery. Before hardware release, verify transceiver electrical requirements and all MCU pin assignments because those details are [DATA_NEEDED: ball map and CAN electrical limits].
Empfohlen
Human-Machine Interface Controller
The PK30N512VMD100's listed LCD interface, 102 I/O, 512 KB Flash, and 128K x 8 RAM make it suitable for a legacy human-machine interface controller. It can organize display updates, keypad or touch inputs, status indicators, and serial configuration while the Cortex-M4 core handles control logic at up to 100 MHz. The integrated LCD feature does not eliminate external driver or panel requirements, and complete timing parameters are [DATA_NEEDED: LCD interface timing and electrical limits]. BGA assembly and obsolete availability should be considered before new production use.
Empfohlen
Serial Gateway
A legacy protocol-conversion gateway can use the PK30N512VMD100's listed I2C, SPI, UART/USART, IrDA, and SD interfaces alongside DMA and 512 KB Flash. Firmware can maintain protocol state, buffer transfers, and bridge communications among sensors, storage, or host processors while the 100 MHz core handles multiple tasks. The available evidence does not specify maximum peripheral frequencies or package-level multiplexing, so the designer must confirm every signal in the device documentation. Obsolete status makes source reservation and traceability especially important.
Empfohlen
Motor and Power Control
The PK30N512VMD100 can serve in a legacy motor or power-control subsystem where its 100 MHz Cortex-M4 core, PWM, watchdog, DMA, and communication interfaces coordinate commands and diagnostics. Multiple I/O and 512 KB Flash support timing tasks, control tables, logging, and supervisory protocols. It does not replace external power devices, gate drivers, current sensing, or protection hardware. Exact PWM resolution, timer clocks, analog limits, and thermal performance are [DATA_NEEDED], so a production design must use the manufacturer data and validate worst-case timing and fault behavior.
Empfohlen
Audio Data Controller
The PK30N512VMD100's listed I2S and DMA interfaces, together with 128K x 8 RAM and a 100 MHz core, support legacy audio buffering, sampling control, and communication tasks. A system could use I2S for digital audio transfer while DMA reduces processor involvement in data movement. Spare serial interfaces may connect control commands or configuration storage. Actual audio-rate limits, I2S operating modes, and pin multiplexing are [DATA_NEEDED], so claims must be verified against the exact datasheet before implementation. The obsolete lifecycle status further limits suitability for new designs.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für PK30N512VMD100 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MK60DN512ZVMD10 | MK10DN512ZAB10R | MK21FX512VMD12 | MK51DN512ZCLQ10 | MK50DN512CLQ10 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
Wichtigste Unterscheidungsmerkmale
- Exact legacy K30 configuration for continuity (vs. MK60DN512ZVMD10)
- Broad verified peripheral set (vs. MK10DN512ZAB10R)
- Obsolete status requires sourcing discipline (vs. MK21FX512VMD12)
Designhinweise
Do not treat a 144-BGA package designation as proof that an alternative MCU is drop-in compatible. The replacement review must compare all ball assignments, power and ground domains, voltage tolerances, clock inputs, peripheral multiplexing, memory organization, debug signals, and exposed thermal features. The supplied cross-reference results do not provide that complete comparison, so every proposed replacement remains subject to manufacturer documentation and hardware validation.
Plan the 13 x 13 mm MAPBGA layout with controlled escape routing, adequate via access beneath fine-pitch balls, and assembly-process capability appropriate to the package. Because the complete ball map is unavailable in the verified data, do not release placement, routing, or power-plane assignments until the manufacturer package drawing is obtained. Also verify land pattern dimensions, solder-mask policy, paste stencil, and reflow profile with the selected board assembler.
The verified listing names 1.8 V, 2.5 V, and 3.3 V supply options, but does not identify rail topology, current limits, sequencing, or tolerance. Before schematic release, map every supply ball and external component against the official data sheet, then size regulators and decoupling for worst-case current. Estimated power calculations are not possible from the supplied data because operating current and efficiency values are [DATA_NEEDED].
Do not estimate junction temperature from clock speed alone. Thermal design depends on actual supply voltage, active current, package thermal resistance, board copper, ambient temperature, and neighboring heat sources, none of which are fully supplied here. Use the manufacturer thermal model and application-specific board data. For obsolete inventory, preserve lot identity and inspection records so thermal and quality history can be linked to the exact device lot.
Separate sensitive analog, communication, clock, and digital return paths where the device architecture requires isolation. Place required decoupling and support components according to the verified pin and reference-design guidance, which is [DATA_NEEDED] in the supplied records. Route high-current outputs and external-interface protection away from processor and memory signals. Complete signal-integrity and EMC checks using the actual clocks, edge rates, board stack-up, and peripheral configuration.
Compliance-Informationen
The supplied distributor and datasheet search results do not contain verified material-compliance declarations. Obtain declarations for the exact MPN and manufacturing lot before procurement or product release.
