RTAX2000DL-1CQ352V vs RTAX2000SL-1CQ352V Vergleich

Detaillierter Direktvergleich von RTAX2000DL-1CQ352V von Microchip Technology und RTAX2000SL-1CQ352V von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Microchip Technology
RTAX2000DL-1CQ352V RTAX2000DL-1CQ352V - 2M-Gate Rad-Tolerant FPGA | Microchip

RTAX2000DL-1CQ352V - 2M-Gate Rad-Tolerant FPGA | Microchip

RTAX2000DL-1CQ352V ✓ Aktiv
Microchip Technology
RTAX2000SL-1CQ352V RTAX2000SL-1CQ352V - 2M-Gate Rad-Tolerant FPGA | Microchip

RTAX2000SL-1CQ352V - 2M-Gate Rad-Tolerant FPGA | Microchip

RTAX2000SL-1CQ352V ✓ Aktiv

Spezifikationsvergleich

Parameter RTAX2000DL-1CQ352V RTAX2000SL-1CQ352V
Marke Microchip Technology Microchip Technology
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $2.950,00 $2.050,00
Family RTAX-DSP (RTAX2000DL) RTAX-S/SL Radiation-Tolerant FPGA
Equivalent System Gates 2,000,000 (approx.) 2,000,000
Logic Cells 29,568 32,256
CLBs 19,712 —
Core Supply Voltage 1.425 V to 1.575 V (nominal 1.5 V) 1.5 V (1.425 V to 1.575 V)
Technology Digital CMOS —
Programming Technology Antifuse (one-time programmable) —
Radiation Tolerance Radiation-tolerant (RTAX-DSP) Radiation-tolerant (space flight grade)
Configuration Live at power-up, no external boot memory Live at power-up, single chip (antifuse)
Speed Grade -1 —
Gehäuse CQ352 (352-pin ceramic QFP) 352-pin ceramic CQFP (CQ352)
Montageart Surface Mount Surface Mount
Application Domain Space-flight systems Space flight systems
Special Features DSP multiply-accumulate blocks (DL variant) —
RoHS-Status [DATA_NEEDED: RoHS Status] [DATA_NEEDED: RoHS status]
Betriebstemperatur [DATA_NEEDED: Operating Temperature] [DATA_NEEDED: operating temperature range]
Embedded SRAM [DATA_NEEDED: Embedded SRAM capacity] —
CLB Count — 21,504
Process Technology — CMOS, antifuse OTP interconnect
Embedded Memory — Embedded SRAM with built-in FIFO control
Clocking — Segmentable clock resources, chip-wide highway routing
I/O Supply Voltage — [DATA_NEEDED: I/O bank voltage]
Total Ionizing Dose (TID) — [DATA_NEEDED: TID rating]
MSL-Level — Not applicable (ceramic package)

Datenblätter & Ressourcen

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