RTAX2000DL-1CQ352V vs RTAX2000SL-1CQ352V Comparaison
Comparaison détaillée côte à côte de RTAX2000DL-1CQ352V par Microchip Technology et RTAX2000SL-1CQ352V par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Microchip Technology
RTAX2000DL-1CQ352V - 2M-Gate Rad-Tolerant FPGA | Microchip
RTAX2000DL-1CQ352V ✓ ActifMicrochip Technology
RTAX2000SL-1CQ352V - 2M-Gate Rad-Tolerant FPGA | Microchip
RTAX2000SL-1CQ352V ✓ ActifComparaison des spécifications
| Paramètre | RTAX2000DL-1CQ352V | RTAX2000SL-1CQ352V |
|---|---|---|
| Marque | Microchip Technology | Microchip Technology |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $2 950,00 | $2 050,00 |
| Family | RTAX-DSP (RTAX2000DL) | RTAX-S/SL Radiation-Tolerant FPGA |
| Equivalent System Gates | 2,000,000 (approx.) | 2,000,000 |
| Logic Cells | 29,568 | 32,256 |
| CLBs | 19,712 | — |
| Core Supply Voltage | 1.425 V to 1.575 V (nominal 1.5 V) | 1.5 V (1.425 V to 1.575 V) |
| Technology | Digital CMOS | — |
| Programming Technology | Antifuse (one-time programmable) | — |
| Radiation Tolerance | Radiation-tolerant (RTAX-DSP) | Radiation-tolerant (space flight grade) |
| Configuration | Live at power-up, no external boot memory | Live at power-up, single chip (antifuse) |
| Speed Grade | -1 | — |
| Boîtier | CQ352 (352-pin ceramic QFP) | 352-pin ceramic CQFP (CQ352) |
| Type de montage | Surface Mount | Surface Mount |
| Application Domain | Space-flight systems | Space flight systems |
| Special Features | DSP multiply-accumulate blocks (DL variant) | — |
| Statut RoHS | [DATA_NEEDED: RoHS Status] | [DATA_NEEDED: RoHS status] |
| Température de fonctionnement | [DATA_NEEDED: Operating Temperature] | [DATA_NEEDED: operating temperature range] |
| Embedded SRAM | [DATA_NEEDED: Embedded SRAM capacity] | — |
| CLB Count | — | 21,504 |
| Process Technology | — | CMOS, antifuse OTP interconnect |
| Embedded Memory | — | Embedded SRAM with built-in FIFO control |
| Clocking | — | Segmentable clock resources, chip-wide highway routing |
| I/O Supply Voltage | — | [DATA_NEEDED: I/O bank voltage] |
| Total Ionizing Dose (TID) | — | [DATA_NEEDED: TID rating] |
| Niveau MSL | — | Not applicable (ceramic package) |