RTAX2000S-1CG1152V vs RTAX2000S-1LG1152V Vergleich

Detaillierter Direktvergleich von RTAX2000S-1CG1152V von Microchip Technology und RTAX2000S-1LG1152V von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Microchip Technology
RTAX2000S-1CG1152V RTAX2000S-1CG1152V - 2M-Gate Rad-Tolerant FPGA | Microchip

RTAX2000S-1CG1152V - 2M-Gate Rad-Tolerant FPGA | Microchip

RTAX2000S-1CG1152V ✓ Aktiv
Microchip Technology
RTAX2000S-1LG1152V RTAX2000S-1LG1152V - 2M-Gate Rad-Tolerant FPGA | Microchip

RTAX2000S-1LG1152V - 2M-Gate Rad-Tolerant FPGA | Microchip

RTAX2000S-1LG1152V ✓ Aktiv

Spezifikationsvergleich

Parameter RTAX2000S-1CG1152V RTAX2000S-1LG1152V
Marke Microchip Technology Microchip Technology
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $0,00 $0,00
Family RTAX-S / RTAX2000S RTAX-S/SL Radiation-Tolerant FPGAs
Equivalent System Gates 2,000,000 gates 2,000,000 gates
CLBs 21,504 —
Logic Cells 32,256 32,256
Usable I/O 684 inputs / 684 outputs —
Gehäuse 1152-terminal Ceramic, Metal-Sealed Cofired CBGA (CGA1152) 1152-ball ceramic column grid array (LG1152 / CGA-1152)
Technology 0.15 um CMOS, antifuse OTP CMOS antifuse (OTP)
Core Voltage 1.5 V [DATA_NEEDED: core supply voltage]
Speed Grade -1 -1
Radiation Tolerance Radiation-tolerant (TID/SEE rated, see datasheet) Radiation-tolerant for space flight systems
Configuration Live at power-up, single-chip antifuse Live at power-up (antifuse, no external boot device)
Embedded SRAM Yes, with built-in FIFO control logic —
Embedded Clocking Segmentable clocks, chip-wide features —
Betriebstemperatur [DATA_NEEDED: operating temperature range] [DATA_NEEDED: operating temperature range]
Max I/O Frequency [DATA_NEEDED: maximum I/O frequency] —
Moisture Sensitivity Level [DATA_NEEDED: MSL level] —
CLBs (Logic Elements) — 21,504
Montageart — Surface Mount
Embedded Memory — Embedded SRAM with built-in FIFO control logic
Clock Features — Segmentable clocks, chip-wide synchronization
Programmability — One-time programmable (OTP)
Power — [DATA_NEEDED: static and dynamic power figures]
Qualification — Space/defense qualified flow (see Microchip DLA Cross Reference Guide)
RoHS-Status — unknown (ceramic hermetic package; verify on product page)

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