RTAX2000S-1CG1152V vs RTAX2000S-1LG1152V Comparación

Comparación detallada lado a lado de RTAX2000S-1CG1152V por Microchip Technology y RTAX2000S-1LG1152V por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.

Microchip Technology
RTAX2000S-1CG1152V RTAX2000S-1CG1152V - 2M-Gate Rad-Tolerant FPGA | Microchip

RTAX2000S-1CG1152V - 2M-Gate Rad-Tolerant FPGA | Microchip

RTAX2000S-1CG1152V ✓ Activo
Microchip Technology
RTAX2000S-1LG1152V RTAX2000S-1LG1152V - 2M-Gate Rad-Tolerant FPGA | Microchip

RTAX2000S-1LG1152V - 2M-Gate Rad-Tolerant FPGA | Microchip

RTAX2000S-1LG1152V ✓ Activo

Comparación de especificaciones

Parámetro RTAX2000S-1CG1152V RTAX2000S-1LG1152V
Marca Microchip Technology Microchip Technology
Categoría FPGA & CPLD FPGA & CPLD
Estado del ciclo de vida Activo Activo
Estado del stock In Stock In Stock
Precio unitario (USD) $0,00 $0,00
Family RTAX-S / RTAX2000S RTAX-S/SL Radiation-Tolerant FPGAs
Equivalent System Gates 2,000,000 gates 2,000,000 gates
CLBs 21,504 —
Logic Cells 32,256 32,256
Usable I/O 684 inputs / 684 outputs —
Encapsulado 1152-terminal Ceramic, Metal-Sealed Cofired CBGA (CGA1152) 1152-ball ceramic column grid array (LG1152 / CGA-1152)
Technology 0.15 um CMOS, antifuse OTP CMOS antifuse (OTP)
Core Voltage 1.5 V [DATA_NEEDED: core supply voltage]
Speed Grade -1 -1
Radiation Tolerance Radiation-tolerant (TID/SEE rated, see datasheet) Radiation-tolerant for space flight systems
Configuration Live at power-up, single-chip antifuse Live at power-up (antifuse, no external boot device)
Embedded SRAM Yes, with built-in FIFO control logic —
Embedded Clocking Segmentable clocks, chip-wide features —
Temperatura de funcionamiento [DATA_NEEDED: operating temperature range] [DATA_NEEDED: operating temperature range]
Max I/O Frequency [DATA_NEEDED: maximum I/O frequency] —
Moisture Sensitivity Level [DATA_NEEDED: MSL level] —
CLBs (Logic Elements) — 21,504
Tipo de montaje — Surface Mount
Embedded Memory — Embedded SRAM with built-in FIFO control logic
Clock Features — Segmentable clocks, chip-wide synchronization
Programmability — One-time programmable (OTP)
Power — [DATA_NEEDED: static and dynamic power figures]
Qualification — Space/defense qualified flow (see Microchip DLA Cross Reference Guide)
Estado RoHS — unknown (ceramic hermetic package; verify on product page)

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