RTAX2000S-1CG1152V vs RTAX2000S-1LG1152V Comparaison

Comparaison détaillée côte à côte de RTAX2000S-1CG1152V par Microchip Technology et RTAX2000S-1LG1152V par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.

Microchip Technology
RTAX2000S-1CG1152V RTAX2000S-1CG1152V - 2M-Gate Rad-Tolerant FPGA | Microchip

RTAX2000S-1CG1152V - 2M-Gate Rad-Tolerant FPGA | Microchip

RTAX2000S-1CG1152V ✓ Actif
Microchip Technology
RTAX2000S-1LG1152V RTAX2000S-1LG1152V - 2M-Gate Rad-Tolerant FPGA | Microchip

RTAX2000S-1LG1152V - 2M-Gate Rad-Tolerant FPGA | Microchip

RTAX2000S-1LG1152V ✓ Actif

Comparaison des spécifications

Paramètre RTAX2000S-1CG1152V RTAX2000S-1LG1152V
Marque Microchip Technology Microchip Technology
Catégorie FPGA & CPLD FPGA & CPLD
Statut du cycle de vie Actif Actif
Statut du stock In Stock In Stock
Prix unitaire (USD) $0,00 $0,00
Family RTAX-S / RTAX2000S RTAX-S/SL Radiation-Tolerant FPGAs
Equivalent System Gates 2,000,000 gates 2,000,000 gates
CLBs 21,504 —
Logic Cells 32,256 32,256
Usable I/O 684 inputs / 684 outputs —
Boîtier 1152-terminal Ceramic, Metal-Sealed Cofired CBGA (CGA1152) 1152-ball ceramic column grid array (LG1152 / CGA-1152)
Technology 0.15 um CMOS, antifuse OTP CMOS antifuse (OTP)
Core Voltage 1.5 V [DATA_NEEDED: core supply voltage]
Speed Grade -1 -1
Radiation Tolerance Radiation-tolerant (TID/SEE rated, see datasheet) Radiation-tolerant for space flight systems
Configuration Live at power-up, single-chip antifuse Live at power-up (antifuse, no external boot device)
Embedded SRAM Yes, with built-in FIFO control logic —
Embedded Clocking Segmentable clocks, chip-wide features —
Température de fonctionnement [DATA_NEEDED: operating temperature range] [DATA_NEEDED: operating temperature range]
Max I/O Frequency [DATA_NEEDED: maximum I/O frequency] —
Moisture Sensitivity Level [DATA_NEEDED: MSL level] —
CLBs (Logic Elements) — 21,504
Type de montage — Surface Mount
Embedded Memory — Embedded SRAM with built-in FIFO control logic
Clock Features — Segmentable clocks, chip-wide synchronization
Programmability — One-time programmable (OTP)
Power — [DATA_NEEDED: static and dynamic power figures]
Qualification — Space/defense qualified flow (see Microchip DLA Cross Reference Guide)
Statut RoHS — unknown (ceramic hermetic package; verify on product page)

Fiches techniques et ressources

Parcourir tous les produits Créer un BOM Demander un devis