RTAX4000SL-1CQ352V - 4M-Gate Rad-Tolerant FPGA | Microchip
Teilenummer: RTAX4000SL-1CQ352V ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $4500 | $4.500,00 |
| 10 | $4275 | $42.750,00 |
| 100 | $4050 | $405.000,00 |
| 500 | $3825 | $1.912.500,00 |
| 1.000 | $3600 | $3.600.000,00 |
RTAX4000SL-1CQ352V Übersicht
A radiation-tolerant FPGA is a programmable logic device engineered to survive the high total ionizing dose (TID), heavy-ion latch-up, and single-event upset (SEU) environments encountered in Earth-orbiting and deep-space missions. Within the product hierarchy, the RTAX4000SL-1CQ352V sits in the RTAX-S/SL family, which Microchip (formerly Actel, then Microsemi) positions as the space-flight counterpart of the commercial Axcelerator FPGA line.
Key features include true single-chip operation enabled by antifuse programming (no external configuration PROM required), live-at-power-up (LAPU) behavior for critical boot logic, embedded SRAM blocks with built-in FIFO control logic, and segmentable clock regions that simplify timing closure at high logic utilization.
Architecturally, the device is fabricated in a CMOS process and inherits the Axcelerator fabric structure: asea of logic modules with dedicated carry chains, embedded FIFO/ECC-capable SRAM, and chip-wide routing. The SL suffix denotes the enhanced reliability lot flow developed for the RTAX-SL generation, improving antifuse uniformity and tolerance to space radiation effects relative to the original RTAX-S devices.
Typical applications include satellite payload data processing, spacecraft bus controllers, instrument interface bridging, and reconfiguration/telemetry logic on launch vehicles and deep-space probes, where SEU-hardened fabric and low static power are essential.
A key design consideration is that antifuse devices are one-time programmable: verification must be exhaustive before flight-unit programming, and prototyping is normally done on the pin-compatible Axcelerator commercial device using Microchip's adaptor-board methodology.
This page synthesizes distributor stock intelligence, same-footprint family alternatives, and practical design notes not found in the manufacturer datasheet. Pricing shown reflects distributor quotes as of 2026-09-02.
Drop-in-Alternativen für RTAX4000SL-1CQ352V – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit RTAX4000SL-1CQ352V (gleiche Bauform und Footprint) – abweichend in Family, Package, Logic Cells, Equivalent System Gates, Process Technology.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
RTAX4000SL-1CQ352B
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →RTAX4000SL-CQ352B
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$1 / Stück
Datenblatt ansehen →RTAX4000SL-1CQ352E
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$3840 / Stück
Datenblatt ansehen →RTAX4000SL-1CQ352EV
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Preis auf Anfrage
Datenblatt ansehen →RTAX4000D-1CQ352V
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →RTAX4000D-CQ352V
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
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Datenblatt ansehen →RTAX4000DL-CQ352V
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$4200 / Stück
Datenblatt ansehen →RTAX4000SL-1CQ352V Grenzwerte & elektrische Eigenschaften
| Logic Elements (CLBs) | 40320 |
| Logic Cells | 60480 |
| Equivalent System Gates | 4000000 |
| Family | RTAX-S/SL Radiation-Tolerant FPGAs |
| Technology | CMOS, antifuse (one-time programmable) |
| Speed Grade | -1 |
| Gehäuse | CQ352 (ceramic, 352-pin) |
| Quality / Screening Grade | V (space qualification level) |
| Embedded SRAM | Yes, with built-in FIFO control logic |
| Power-Up Behavior | Live at power-up (LAPU) |
| Configuration | Single-chip, no external boot PROM |
| Target Market | Space-flight systems |
| Base Architecture | Axcelerator (commercial counterpart) |
| Radiation Immunity | Configuration immune to single-event upset (antifuse) |
RTAX4000SL-1CQ352V cq352 (ceramic, 352-pin) Pinbelegungsleitfaden
Pinbelegung für RTAX4000SL-1CQ352V (cq352 (ceramic, 352-pin)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für RTAX4000SL-1CQ352V.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
RTAX4000SL-1CQ352V ist geeignet für 6 Anwendungs: Satellite Payload Data Processing, Spacecraft Bus Control and Telemetry, Instrument Interface and Sensor Bridging, Launch Vehicle Avionics, Deep-Space Probe Digital Logic, Radiation-Hardened Reconfigurable Computing Testbeds.
Satellite Payload Data Processing
The RTAX4000SL-1CQ352V fits satellite payload processing because its 4,000,000 equivalent gates (40,320 CLBs) provide enough capacity to implement packet framing, compression pipelines, and sensor data formatting in a single chip, while the antifuse fabric is immune to configuration upsets from single-event effects - a decisive advantage over SRAM FPGAs in orbit. Typical deployments place the FPGA between payload sensors and the downlink chain, using its embedded SRAM with built-in FIFO control logic for cross-clock-domain buffering. Because the device is live at power-up with no external boot PROM, the payload logic is operational immediately after switch-on, reducing boot-failure risk. The trade-off is one-time programmability: flight bitstreams must be fully verified during prototyping on the pin-compatible commercial Axcelerator device.
Empfohlen
Spacecraft Bus Control and Telemetry
For spacecraft bus controllers, command handling, and telemetry aggregation, the RTAX4000SL-1CQ352V offers live-at-power-up operation and true single-chip form factor: the configuration cannot be corrupted in orbit and needs no configuration memory part that itself could fail under radiation. The 60,480 logic cells accommodate MIL-STD-1553-style bus interfaces, UART/SPI command decoders, and housekeeping-data aggregation alongside a soft processor or fixed FSM control structures. Segmentable clock regions simplify implementation of independent clock domains for the bus, the processor, and the telemetry framer. Design teams typically partition the logic so that critical safety modes are combinational or register-based fabric, applying triple-module redundancy only where RAM-backed storage is used, since the antifuse routing itself is configuration-upset immune.
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Instrument Interface and Sensor Bridging
Scientific instruments on space platforms (imagers, spectrometers, particle detectors) require glueless bridging between high-speed sensor front ends and on-board data handling. The RTAX4000SL-1CQ352V serves this role with 4 million system gates of configurable fabric, dedicated carry chains for DSP-like accumulation, and embedded FIFO/ECC-capable SRAM for sensor-stream buffering. Its -1 speed grade supports the moderate clock rates typical of space interfaces while keeping static power low - critical for missions with tight power budgets. Because the ceramic CQ352 package withstands launch vibration and meets vacuum outgassing expectations, it integrates directly on instrument electronics boards. Engineers should prototype interface logic on the commercial Axcelerator counterpart using Microchip's adaptor-board methodology before committing the antifuse flight device.
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Launch Vehicle Avionics
Launch-vehicle avionics demand logic that is functional at the instant of power application and immune to configuration upsets during the vibration and radiation environment of ascent. The RTAX4000SL-1CQ352V addresses both requirements: antifuse configuration is permanent and SEU-immune, and live-at-power-up behavior removes boot-time dependencies. The 40,320-CLB capacity implements flight-event sequencers, redundant-voter logic for triple-module-redundant control paths, and telemetry encoders in one ceramic-packaged device. The 'V' space screening suffix supports the parts qualification documentation expected in launcher programs. Note the design discipline required: because the device is one-time programmable, all timing closure and functional verification must be completed on the prototype flow before flight-unit programming, and programmed units should be serialized with full traceability.
Empfohlen
Deep-Space Probe Digital Logic
Deep-space missions face cumulative total ionizing dose and heavy-ion environments over multi-year cruises. The RTAX4000SL-1CQ352V, from the SL-enhanced reliability lot flow of the RTAX-S/SL family, is designed for exactly these conditions: the antifuse configuration cannot soft-error, and the SL process improves antifuse uniformity relative to the original RTAX-S generation. Its 4-million-gate capacity supports autonomous fault-management logic, science-data compression, and communication framing on probes where no repair is possible. Low static power conserves the limited electrical budget far from the Sun. Design practice includes applying Microchip's SEU-mitigation guidance to the embedded SRAM and validating the design on the pin-compatible commercial Axcelerator device or an Aldec flash-based ProASIC3E adaptor before flight-device programming.
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Radiation-Hardened Reconfigurable Computing Testbeds
Research programs characterizing FPGA behavior in radiation (beam-line testing, on-orbit experiments) use the RTAX4000SL-1CQ352V as a reference antifuse platform against which SRAM-FPGA upset rates are compared. Its 60,480 logic cells allow implementation of the same experimental design on both antifuse and SRAM devices, isolating configuration-upset differences; the embedded SRAM with FIFO control logic provides a controlled target for memory-upset measurement. The -1 speed grade and CQ352 ceramic package simplify fixture design and reuse across test campaigns. Microchip's documented flow - targeting the RTAX-S design to the equivalent commercial Axcelerator part via EDIF netlist and pinout conversion - allows researchers to run identical netlists on reprogrammable hardware between beam exposures, then confirm final configurations on the flight-representative antifuse device.
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Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für RTAX4000SL-1CQ352V – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | RTAX4000SL-1CQ352B | RTAX4000SL-CQ352B | RTAX4000D-1CQ352V | RTAX4000DL-CQ352V |
|---|---|---|---|---|---|
| Package | CQ352 (ceramic, 352-pin) | CQ352 - same | CQ352 - same | CQ352 - same | CQ352 - same |
| Brand | Microchip Technology (Actel/Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Equivalent System Gates | 4,000,000 | 4,000,000 | 4,000,000 | 4,000,000 | 4,000,000 |
| Speed Grade | -1 | -1 | Standard | -1 | Standard |
| Screening Suffix | V (space qualification) | B | B | V | V |
| Configuration Technology | CMOS antifuse (OTP) | CMOS antifuse (OTP) | CMOS antifuse (OTP) | CMOS antifuse (OTP) | CMOS antifuse (OTP) |
| Target Market | Space-flight systems | Space-flight systems | Space-flight systems | Space-flight systems | Space-flight systems |
| Embedded SRAM / FIFO | Yes, with FIFO control logic | Yes, with FIFO control logic | Yes, with FIFO control logic | Yes, higher SRAM density (D die) | Yes, higher SRAM density (DL die) |
Wichtigste Unterscheidungsmerkmale
- Largest density in the RTAX-SL family (vs. RTAX2000SL-1CQ352V)
- Fastest speed grade availability (vs. RTAX4000SL-CQ352B)
- Higher embedded SRAM in same footprint (D-die option) (vs. RTAX4000D-1CQ352V)
- Configuration immune to single-event upset (vs. SRAM-based space FPGAs (cross-brand))
Designhinweise
The RTAX4000SL is one-time programmable. Complete full functional verification, timing closure, and radiation-mitigation review on the pin-compatible commercial Axcelerator device or on an Aldec ACT-H3Ki-CQ352 flash-based prototyping adaptor BEFORE programming a flight unit. Microchip's documented prototyping flow uses an EDIF netlist and pinout converter to migrate the design between the commercial target and the RTAX-S device - budget this conversion step into the schedule, as re-spinning a programmed flight part is impossible.
Design the power tree around the core and I/O rails specified in the Microchip RTAX-S/SL datasheet (consult the datasheet for exact voltages and current estimates for the 4M-gate die at your toggle rate). Antifuse FPGAs draw very low static power - a key advantage over SRAM FPGAs in orbit - but dynamic power scales with clock segmentation. Use the family's segmentable clock regions to gate unused logic, and size the power converter for inrush at power-up with adequate margin per the manufacturer's power-estimation guidance.
The 352-pin CQ352 ceramic package supports high-fanout clock and bus interfaces typical of spaceflight boards. Follow Microchip's RTAX-S PCB layout guidance: define impedance-controlled traces for fast I/O banks, use the datasheet's recommended IBIS models for flight-termination analysis, and decouple each supply pin pair with ceramic capacitors placed within a few millimeters of the package. For radiation programs, route triple-module-redundant signals symmetrically where board-level voting is used, and consult the manufacturer application notes for CQ352 land-pattern and column-grid assembly details.
When substituting among RTAX4000 family CQ352 members (SL, D, DL dies, or different screening suffixes), the land pattern and pinout are footprint-compatible, so the PCB needs no change. However, verify embedded-SRAM capacity if migrating from SL to D/DL dies mid-program, and confirm with Microchip that the target screening suffix (V, B, E, EV) is available for the required date code before releasing the drawing - suffix availability varies by production lot and program demand.
Compliance-Informationen
Space-grade ceramic-packaged device; environmental compliance data was not present in the provided web data. Screening is per Microchip space flows (V suffix), not automotive AEC-Q100. Consult the Microchip product page and certificate of conformance for program-specific environmental declarations.
