S912XD128F2MAL vs S912XDG128F2MAL Vergleich
Detaillierter Direktvergleich von S912XD128F2MAL von NXP Semiconductors und S912XDG128F2MAL von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
S912XD128F2MAL - 16-bit HCS12X MCU, 128KB Flash | NXP
S912XD128F2MAL ✗ AbgekündigtNXP Semiconductors
S912XDG128F2MAL - 16-bit 80MHz 128KB MCU | NXP | Automotive
S912XDG128F2MAL ✗ AbgekündigtSpezifikationsvergleich
| Parameter | S912XD128F2MAL | S912XDG128F2MAL |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Ende des Lebenszyklus | Ende des Lebenszyklus |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $6,10 | $7,95 |
| Core Architecture | HCS12X (16-bit) | — |
| Instruction Set | Upward-compatible with HCS12 | — |
| Program Flash | 128 KB | — |
| RAM | [DATA_NEEDED: RAM size] | — |
| EEPROM | [DATA_NEEDED: EEPROM size] | — |
| Maximum CPU Frequency | 80 MHz | — |
| Operating Voltage | [DATA_NEEDED: VDD range] | — |
| Versorgungsspannung | 5 V (typical automotive) | 2.5 V / 5 V |
| Betriebstemperaturbereich | -40 °C to +125 °C | — |
| Temperature Grade | Automotive | — |
| Gehäuse | 112-LQFP (20x20 mm) | — |
| Terminal Form | Gull Wing | Gull Wing |
| Number of Terminals | 112 | — |
| Package Code | QFP | — |
| Package Shape | Square | — |
| Montageart | Surface Mount | Surface Mount |
| ADC | 10-bit | — |
| Communication Peripherals | CAN, SPI, SCI (UART), I²C | — |
| Timers | ECT, PWM, TIM (16-bit) | — |
| External Bus Interface | Yes (multiplexed) | — |
| Debug Interface | BDM | — |
| RoHS | Compliant per distributor listings | — |
| Core Processor | — | HCS12X (16-bit CISC) |
| Core Size | — | 16-bit |
| Speed | — | 80 MHz |
| Program Memory Size | — | 128 KB (128K x 8) Flash |
| RAM Size | — | 12K x 8 |
| Number of I/O | — | 91 |
| Gehäuse / Bauform | — | 112-LQFP (20x20 mm) |
| Betriebstemperatur | — | -40 degC to +125 degC |
| Industry Application | — | Automotive |
| Qualification | — | AEC-Q100 |
| Architecture Compatibility | — | Upward compatible with HCS12 instruction set |
| Packaging | — | Tray |
| RoHS-Status | — | [DATA_NEEDED: RoHS status] |
| EEPROM Size | — | [DATA_NEEDED: EEPROM size] |