S912XD128F2MAL vs S912XDG128F2MAL Comparaison
Comparaison détaillée côte à côte de S912XD128F2MAL par NXP Semiconductors et S912XDG128F2MAL par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
S912XD128F2MAL - 16-bit HCS12X MCU, 128KB Flash | NXP
S912XD128F2MAL ✗ Fin de vieNXP Semiconductors
S912XDG128F2MAL - 16-bit 80MHz 128KB MCU | NXP | Automotive
S912XDG128F2MAL ✗ Fin de vieComparaison des spécifications
| Paramètre | S912XD128F2MAL | S912XDG128F2MAL |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Fin de vie | Fin de vie |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $6,10 | $7,95 |
| Core Architecture | HCS12X (16-bit) | — |
| Instruction Set | Upward-compatible with HCS12 | — |
| Program Flash | 128 KB | — |
| RAM | [DATA_NEEDED: RAM size] | — |
| EEPROM | [DATA_NEEDED: EEPROM size] | — |
| Maximum CPU Frequency | 80 MHz | — |
| Operating Voltage | [DATA_NEEDED: VDD range] | — |
| Tension d'alimentation | 5 V (typical automotive) | 2.5 V / 5 V |
| Plage de température de fonctionnement | -40 °C to +125 °C | — |
| Temperature Grade | Automotive | — |
| Boîtier | 112-LQFP (20x20 mm) | — |
| Terminal Form | Gull Wing | Gull Wing |
| Number of Terminals | 112 | — |
| Package Code | QFP | — |
| Package Shape | Square | — |
| Type de montage | Surface Mount | Surface Mount |
| ADC | 10-bit | — |
| Communication Peripherals | CAN, SPI, SCI (UART), I²C | — |
| Timers | ECT, PWM, TIM (16-bit) | — |
| External Bus Interface | Yes (multiplexed) | — |
| Debug Interface | BDM | — |
| RoHS | Compliant per distributor listings | — |
| Core Processor | — | HCS12X (16-bit CISC) |
| Core Size | — | 16-bit |
| Speed | — | 80 MHz |
| Program Memory Size | — | 128 KB (128K x 8) Flash |
| RAM Size | — | 12K x 8 |
| Number of I/O | — | 91 |
| Boîtier / Format | — | 112-LQFP (20x20 mm) |
| Température de fonctionnement | — | -40 degC to +125 degC |
| Industry Application | — | Automotive |
| Qualification | — | AEC-Q100 |
| Architecture Compatibility | — | Upward compatible with HCS12 instruction set |
| Packaging | — | Tray |
| Statut RoHS | — | [DATA_NEEDED: RoHS status] |
| EEPROM Size | — | [DATA_NEEDED: EEPROM size] |