S912XD128F2MAL vs S912XDG128F2MAL Comparación
Comparación detallada lado a lado de S912XD128F2MAL por NXP Semiconductors y S912XDG128F2MAL por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
S912XD128F2MAL - 16-bit HCS12X MCU, 128KB Flash | NXP
S912XD128F2MAL ✗ Fin de vidaNXP Semiconductors
S912XDG128F2MAL - 16-bit 80MHz 128KB MCU | NXP | Automotive
S912XDG128F2MAL ✗ Fin de vidaComparación de especificaciones
| Parámetro | S912XD128F2MAL | S912XDG128F2MAL |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Fin de vida | Fin de vida |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $6,10 | $7,95 |
| Core Architecture | HCS12X (16-bit) | — |
| Instruction Set | Upward-compatible with HCS12 | — |
| Program Flash | 128 KB | — |
| RAM | [DATA_NEEDED: RAM size] | — |
| EEPROM | [DATA_NEEDED: EEPROM size] | — |
| Maximum CPU Frequency | 80 MHz | — |
| Operating Voltage | [DATA_NEEDED: VDD range] | — |
| Tensión de alimentación | 5 V (typical automotive) | 2.5 V / 5 V |
| Rango de temperatura de funcionamiento | -40 °C to +125 °C | — |
| Temperature Grade | Automotive | — |
| Encapsulado | 112-LQFP (20x20 mm) | — |
| Terminal Form | Gull Wing | Gull Wing |
| Number of Terminals | 112 | — |
| Package Code | QFP | — |
| Package Shape | Square | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| ADC | 10-bit | — |
| Communication Peripherals | CAN, SPI, SCI (UART), I²C | — |
| Timers | ECT, PWM, TIM (16-bit) | — |
| External Bus Interface | Yes (multiplexed) | — |
| Debug Interface | BDM | — |
| RoHS | Compliant per distributor listings | — |
| Core Processor | — | HCS12X (16-bit CISC) |
| Core Size | — | 16-bit |
| Speed | — | 80 MHz |
| Program Memory Size | — | 128 KB (128K x 8) Flash |
| RAM Size | — | 12K x 8 |
| Number of I/O | — | 91 |
| Encapsulado / Carcasa | — | 112-LQFP (20x20 mm) |
| Temperatura de funcionamiento | — | -40 degC to +125 degC |
| Industry Application | — | Automotive |
| Qualification | — | AEC-Q100 |
| Architecture Compatibility | — | Upward compatible with HCS12 instruction set |
| Packaging | — | Tray |
| Estado RoHS | — | [DATA_NEEDED: RoHS status] |
| EEPROM Size | — | [DATA_NEEDED: EEPROM size] |