S912XDT256F1MAL vs MC9S12XDT512MAA Vergleich
Detaillierter Direktvergleich von S912XDT256F1MAL von NXP Semiconductors und MC9S12XDT512MAA von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
S912XDT256F1MAL - 16-bit MCU, 256KB Flash, 80MHz | NXP
S912XDT256F1MAL ⚠ Letzte Bestellmöglichkeit
Spezifikationsvergleich
| Parameter | S912XDT256F1MAL | MC9S12XDT512MAA |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Letzte Kaufgelegenheit | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $15,82 | $0,00 |
| Core Architecture | HCS12X (16-bit) | — |
| CPU Core | S12X | — |
| Program Memory Size | 256 KB (256K x 8) Flash | 512KB (512K x 8) |
| RAM Size | 16 KB | 20KB |
| Maximum CPU Frequency | 80 MHz | — |
| Datenbusbreite | 16-bit | — |
| Gehäuse | 112-LQFP (20x20 mm) | 80-QFP (14x14 mm), Square, Gull Wing |
| Pin-Anzahl | 112 | — |
| Montageart | Surface Mount | Surface Mount |
| Betriebstemperaturbereich | -40C to +125C | — |
| Betriebsversorgungsspannung | [DATA_NEEDED: VDD range] | — |
| AEC-Q100 Qualification | Yes (Automotive Qualified) | — |
| Communication Interfaces | CAN, SPI, SCI (UART), I2C | — |
| Debug Interface | BDM / JTAG | — |
| Peripheral Coprocessor | XGATE (DMA accelerator) | — |
| RoHS-Status | Compliant | — |
| Lead-Free / Halogen-Free | Yes (per NXP product page) | — |
| Core Processor | — | HCS12X |
| Core Size | — | 16-Bit |
| Maximum Clock Speed | — | 80 MHz |
| Program Memory Type | — | FLASH |
| EEPROM Size | — | 4KB |
| Connectivity | — | CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI |
| Peripherals | — | LVD, POR, PWM, WDT |
| Number of I/O | — | 59 |
| ADC Resolution | — | 10-bit, 8-channel |
| Versorgungsspannung | — | [DATA_NEEDED: supply voltage range] |
| Betriebstemperatur | — | -40C to +125C (TA) |
| Packaging Method | — | Tray |
| Halogenfrei | — | Compliant |
| ECCN | — | 3A991.a.2 |
| Estimated EOL Date | — | 2028 |