S912XEP100BMAL vs S912XEQ384J3CALR Vergleich
Detaillierter Direktvergleich von S912XEP100BMAL von NXP Semiconductors und S912XEQ384J3CALR von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
S912XEQ384J3CALR - 16-bit 384KB Flash MCU, 112-LQFP | NXP (Tape & Reel)
S912XEQ384J3CALR ✓ AktivSpezifikationsvergleich
| Parameter | S912XEP100BMAL | S912XEQ384J3CALR |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $13,80 | $11,40 |
| Core Architecture | HCS12X (S12X CPU, 16-bit CISC) | — |
| Bus Speed | 50 MHz | 50 MHz |
| Program Memory (Flash) | 1 MB (1M x 8) | 384 KB (384K x 8) |
| XGATE Co-processor | Yes | — |
| EEPROM Emulation | Hardware-emulated using Flash | Yes (hardware-emulated EEE) |
| ADC | 12-bit, 3 us conversion time | — |
| Memory Protection Unit | Yes (supervisor/user modes) | Yes (supervisor/user modes) |
| Timers | ECT, PIT, RTI | — |
| Betriebstemperatur | -40C to +125C (automotive) | -40 C to +85 C (industrial, J grade) |
| Gehäuse | 112-LQFP (20x20 mm) | 112-LQFP (20x20 mm) |
| Montageart | Surface Mount | Surface Mount |
| MSL-Level | [DATA_NEEDED: MSL Level] | — |
| RoHS-Status | Compliant | Compliant |
| Versorgungsspannung | [DATA_NEEDED: VDD range] | — |
| Automotive Qualification | AEC-Q100 qualified | — |
| Core | — | S12X (16-bit HCS12X family) |
| RAM Size | — | 24 KB |
| Number of I/O | — | 91 |
| Terminal Form | — | GULL WING |
| No. of Terminals | — | 112 |
| ADC Resolution | — | 12-bit |
| ADC Conversion Time | — | 3 us |
| Co-Processor | — | XGATE peripheral co-processor |
| Peripherals | — | ECT, PIT, RTI |