S912XEP100BMAL vs S912XEQ384J3CALR Comparación
Comparación detallada lado a lado de S912XEP100BMAL por NXP Semiconductors y S912XEQ384J3CALR por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
S912XEQ384J3CALR - 16-bit 384KB Flash MCU, 112-LQFP | NXP (Tape & Reel)
S912XEQ384J3CALR ✓ ActivoComparación de especificaciones
| Parámetro | S912XEP100BMAL | S912XEQ384J3CALR |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $13,80 | $11,40 |
| Core Architecture | HCS12X (S12X CPU, 16-bit CISC) | — |
| Bus Speed | 50 MHz | 50 MHz |
| Program Memory (Flash) | 1 MB (1M x 8) | 384 KB (384K x 8) |
| XGATE Co-processor | Yes | — |
| EEPROM Emulation | Hardware-emulated using Flash | Yes (hardware-emulated EEE) |
| ADC | 12-bit, 3 us conversion time | — |
| Memory Protection Unit | Yes (supervisor/user modes) | Yes (supervisor/user modes) |
| Timers | ECT, PIT, RTI | — |
| Temperatura de funcionamiento | -40C to +125C (automotive) | -40 C to +85 C (industrial, J grade) |
| Encapsulado | 112-LQFP (20x20 mm) | 112-LQFP (20x20 mm) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Nivel MSL | [DATA_NEEDED: MSL Level] | — |
| Estado RoHS | Compliant | Compliant |
| Tensión de alimentación | [DATA_NEEDED: VDD range] | — |
| Automotive Qualification | AEC-Q100 qualified | — |
| Core | — | S12X (16-bit HCS12X family) |
| RAM Size | — | 24 KB |
| Number of I/O | — | 91 |
| Terminal Form | — | GULL WING |
| No. of Terminals | — | 112 |
| ADC Resolution | — | 12-bit |
| ADC Conversion Time | — | 3 us |
| Co-Processor | — | XGATE peripheral co-processor |
| Peripherals | — | ECT, PIT, RTI |