S9S08AW60E5MFGE vs MC9S08AC32CFDE Vergleich
Detaillierter Direktvergleich von S9S08AW60E5MFGE von NXP Semiconductors und MC9S08AC32CFDE von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
S9S08AW60E5MFGE - 60KB Flash 8-Bit MCU 44-LQFP | NXP (Tape & Reel)
S9S08AW60E5MFGE ✓ AktivNXP Semiconductors
MC9S08AC32CFDE - S08AC 8-bit MCU, 32KB Flash, 40MHz, QFN-48 | NXP
MC9S08AC32CFDE NrndSpezifikationsvergleich
| Parameter | S9S08AW60E5MFGE | MC9S08AC32CFDE |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $6,05 | $3,02 |
| Core Architecture | HCS08 (S08 enhanced), 8-bit CISC | S08 (HCS08 family, 8-bit CISC) |
| CPU Clock (Max) | 40 MHz (20 MHz bus) | — |
| Program Flash | 60 KB (60K x 8) | — |
| RAM | [DATA_NEEDED: RAM size] | 1 KB |
| EEPROM / Data Flash | [DATA_NEEDED: data EEPROM size] | — |
| Versorgungsspannung | 3 V / 3.3 V / 5 V | — |
| Gehäuse | 44-pin LQFP (10 x 10 mm) | 48-QFN-EP (7x7 mm) with exposed thermal pad |
| I/O Pins | [DATA_NEEDED: GPIO count] | — |
| ADC | Multi-channel 10-bit (per family) | 8-channel, 10-bit |
| Communication | SCI (UART), SPI, I2C | — |
| Timers | TPM modules with PWM channels | 16-bit timer/PWM, plus additional 8-bit and 2-channel modules |
| Debug Interface | BDM (Background Debug Mode) | Single-wire BDM (Background Debug Mode) |
| Betriebstemperatur | -40C to +125C (automotive range) | — |
| Montageart | Surface Mount | Surface Mount |
| Family | S08 / MC9S08AW60 series | — |
| Automotive/Industrial | Dual-targeted | — |
| Lead Free / RoHS | Yes (per suffix "E" = Pb-free, "R" = tape & reel) | — |
| Program Memory (Flash) | — | 32 KB |
| Maximum CPU Frequency | — | 40 MHz |
| Supply Voltage (VDD) | — | 2.7 V to 5.5 V |
| Betriebstemperaturbereich | — | -40 C to +125 C (automotive grade) |
| Number of I/O Pins | — | 38 |
| Communication Interfaces | — | SCI (UART) and SPI |
| Internal Clock Source | — | Yes (ICS - Internal Clock Source) |
| Temperature Grade | — | Automotive (AEC-Q100 qualified per NXP product page) [DATA_NEEDED: specific AEC-Q100 grade letter] |
| Datenbusbreite | — | 8-bit |
| MSL (Moisture Sensitivity Level) | — | MSL3 (per QFN-EP package, JEDEC J-STD-020) [DATA_NEEDED: exact floor life] |
| RoHS Compliance | — | Compliant (per NXP product page) |
| Lead-Free | — | Yes (per distributor packaging datasheet) |
| Lebenszyklusstatus | — | NRND (Not Recommended for New Designs, per NXP product page) |