S9S08AW60E5MFGE vs MC9S08AC32CFDE Comparação
Comparação detalhada lado a lado de S9S08AW60E5MFGE por NXP Semiconductors e MC9S08AC32CFDE por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
NXP Semiconductors
S9S08AW60E5MFGE - 60KB Flash 8-Bit MCU 44-LQFP | NXP (Tape & Reel)
S9S08AW60E5MFGE ✓ AtivoNXP Semiconductors
MC9S08AC32CFDE - S08AC 8-bit MCU, 32KB Flash, 40MHz, QFN-48 | NXP
MC9S08AC32CFDE NrndComparação de especificações
| Parâmetro | S9S08AW60E5MFGE | MC9S08AC32CFDE |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoria | Microcontrollers | Microcontrollers |
| Status do ciclo de vida | Ativo | NRND |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $6,05 | $3,02 |
| Core Architecture | HCS08 (S08 enhanced), 8-bit CISC | S08 (HCS08 family, 8-bit CISC) |
| CPU Clock (Max) | 40 MHz (20 MHz bus) | — |
| Program Flash | 60 KB (60K x 8) | — |
| RAM | [DATA_NEEDED: RAM size] | 1 KB |
| EEPROM / Data Flash | [DATA_NEEDED: data EEPROM size] | — |
| Tensão de alimentação | 3 V / 3.3 V / 5 V | — |
| Encapsulamento | 44-pin LQFP (10 x 10 mm) | 48-QFN-EP (7x7 mm) with exposed thermal pad |
| I/O Pins | [DATA_NEEDED: GPIO count] | — |
| ADC | Multi-channel 10-bit (per family) | 8-channel, 10-bit |
| Communication | SCI (UART), SPI, I2C | — |
| Timers | TPM modules with PWM channels | 16-bit timer/PWM, plus additional 8-bit and 2-channel modules |
| Debug Interface | BDM (Background Debug Mode) | Single-wire BDM (Background Debug Mode) |
| Temperatura de operação | -40C to +125C (automotive range) | — |
| Tipo de montagem | Surface Mount | Surface Mount |
| Family | S08 / MC9S08AW60 series | — |
| Automotive/Industrial | Dual-targeted | — |
| Lead Free / RoHS | Yes (per suffix "E" = Pb-free, "R" = tape & reel) | — |
| Program Memory (Flash) | — | 32 KB |
| Maximum CPU Frequency | — | 40 MHz |
| Supply Voltage (VDD) | — | 2.7 V to 5.5 V |
| Faixa de temperatura de operação | — | -40 C to +125 C (automotive grade) |
| Number of I/O Pins | — | 38 |
| Communication Interfaces | — | SCI (UART) and SPI |
| Internal Clock Source | — | Yes (ICS - Internal Clock Source) |
| Temperature Grade | — | Automotive (AEC-Q100 qualified per NXP product page) [DATA_NEEDED: specific AEC-Q100 grade letter] |
| Largura do barramento de dados | — | 8-bit |
| MSL (Moisture Sensitivity Level) | — | MSL3 (per QFN-EP package, JEDEC J-STD-020) [DATA_NEEDED: exact floor life] |
| RoHS Compliance | — | Compliant (per NXP product page) |
| Lead-Free | — | Yes (per distributor packaging datasheet) |
| Status do ciclo de vida | — | NRND (Not Recommended for New Designs, per NXP product page) |