S9S08AW60E5MFGE vs MC9S08AC32CFDE Comparaison
Comparaison détaillée côte à côte de S9S08AW60E5MFGE par NXP Semiconductors et MC9S08AC32CFDE par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
S9S08AW60E5MFGE - 60KB Flash 8-Bit MCU 44-LQFP | NXP (Tape & Reel)
S9S08AW60E5MFGE ✓ ActifNXP Semiconductors
MC9S08AC32CFDE - S08AC 8-bit MCU, 32KB Flash, 40MHz, QFN-48 | NXP
MC9S08AC32CFDE NrndComparaison des spécifications
| Paramètre | S9S08AW60E5MFGE | MC9S08AC32CFDE |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Actif | NRND |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $6,05 | $3,02 |
| Core Architecture | HCS08 (S08 enhanced), 8-bit CISC | S08 (HCS08 family, 8-bit CISC) |
| CPU Clock (Max) | 40 MHz (20 MHz bus) | — |
| Program Flash | 60 KB (60K x 8) | — |
| RAM | [DATA_NEEDED: RAM size] | 1 KB |
| EEPROM / Data Flash | [DATA_NEEDED: data EEPROM size] | — |
| Tension d'alimentation | 3 V / 3.3 V / 5 V | — |
| Boîtier | 44-pin LQFP (10 x 10 mm) | 48-QFN-EP (7x7 mm) with exposed thermal pad |
| I/O Pins | [DATA_NEEDED: GPIO count] | — |
| ADC | Multi-channel 10-bit (per family) | 8-channel, 10-bit |
| Communication | SCI (UART), SPI, I2C | — |
| Timers | TPM modules with PWM channels | 16-bit timer/PWM, plus additional 8-bit and 2-channel modules |
| Debug Interface | BDM (Background Debug Mode) | Single-wire BDM (Background Debug Mode) |
| Température de fonctionnement | -40C to +125C (automotive range) | — |
| Type de montage | Surface Mount | Surface Mount |
| Family | S08 / MC9S08AW60 series | — |
| Automotive/Industrial | Dual-targeted | — |
| Lead Free / RoHS | Yes (per suffix "E" = Pb-free, "R" = tape & reel) | — |
| Program Memory (Flash) | — | 32 KB |
| Maximum CPU Frequency | — | 40 MHz |
| Supply Voltage (VDD) | — | 2.7 V to 5.5 V |
| Plage de température de fonctionnement | — | -40 C to +125 C (automotive grade) |
| Number of I/O Pins | — | 38 |
| Communication Interfaces | — | SCI (UART) and SPI |
| Internal Clock Source | — | Yes (ICS - Internal Clock Source) |
| Temperature Grade | — | Automotive (AEC-Q100 qualified per NXP product page) [DATA_NEEDED: specific AEC-Q100 grade letter] |
| Largeur du bus de données | — | 8-bit |
| MSL (Moisture Sensitivity Level) | — | MSL3 (per QFN-EP package, JEDEC J-STD-020) [DATA_NEEDED: exact floor life] |
| RoHS Compliance | — | Compliant (per NXP product page) |
| Lead-Free | — | Yes (per distributor packaging datasheet) |
| Statut du cycle de vie | — | NRND (Not Recommended for New Designs, per NXP product page) |