S9S08LG32J0VLK vs MC9S08QD4CSC Vergleich
Detaillierter Direktvergleich von S9S08LG32J0VLK von NXP Semiconductors und MC9S08QD4CSC von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
S9S08LG32J0VLK - 32KB Flash LCD 8-bit MCU | NXP/Freescale | Auto
S9S08LG32J0VLK ✓ Aktiv
Spezifikationsvergleich
| Parameter | S9S08LG32J0VLK | MC9S08QD4CSC |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | Ende des Lebenszyklus |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $3,32 | $0,00 |
| Core Architecture | HCS08 (S08), 8-bit | — |
| Program Flash | 32 KB (32K x 8) | — |
| RAM | [DATA_NEEDED: RAM size in KB] | 256 B |
| Maximum CPU Frequency | 40 MHz bus clock | — |
| Supply Voltage (VDD) | 2.7 V to 5.5 V | — |
| Betriebstemperatur | -40C to +105C | [DATA_NEEDED: operating temperature range] |
| I/O Ports | 39 | — |
| LCD Segments (max) | Up to 296 | — |
| LCD Charge Pump | Integrated, up to 7x bias | — |
| ADC | Integrated (peripheral count/configuration per datasheet) | — |
| Timers | MTIM, FTM (per datasheet) | — |
| Communication Peripherals | SCI, SPI, I2C | — |
| Debug Interface | On-chip ICE, BDM, JTAG boundary scan | Background debugging system (single-wire BDM) |
| Gehäuse | 80-pin LQFP (14x14 mm), 0.5 mm pitch | 8-SOIC |
| Montageart | Surface Mount | Surface Mount |
| Lifecycle Stage | ACTIVE | — |
| RoHS-Status | Compliant | — |
| Automotive Qualified | Yes | — |
| MSL-Level | [DATA_NEEDED: MSL rating] | — |
| Core Processor | — | S08 (HCS08), 8-bit CISC |
| Core Size | — | 8-bit |
| Maximale Taktfrequenz | — | 16 MHz |
| Flash Memory | — | 4 KB (4K x 8) |
| Versorgungsspannung | — | 3.3 V / 5 V |
| ADC Resolution | — | 10-bit |
| ADC Channels | — | 4 |
| General-Purpose I/O | — | 6 |
| Instruction Set | — | HC08 with added BGND instruction |
| Packaging | — | Tube |
| Life Cycle Stage | — | End of Life (per NXP product page) |