S9S08LG32J0VLK vs MC9S08QD4CSC Comparação
Comparação detalhada lado a lado de S9S08LG32J0VLK por NXP Semiconductors e MC9S08QD4CSC por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
NXP Semiconductors
S9S08LG32J0VLK - 32KB Flash LCD 8-bit MCU | NXP/Freescale | Auto
S9S08LG32J0VLK ✓ Ativo
Comparação de especificações
| Parâmetro | S9S08LG32J0VLK | MC9S08QD4CSC |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoria | Microcontrollers | Microcontrollers |
| Status do ciclo de vida | Ativo | Fim de vida |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $3,32 | $0,00 |
| Core Architecture | HCS08 (S08), 8-bit | — |
| Program Flash | 32 KB (32K x 8) | — |
| RAM | [DATA_NEEDED: RAM size in KB] | 256 B |
| Maximum CPU Frequency | 40 MHz bus clock | — |
| Supply Voltage (VDD) | 2.7 V to 5.5 V | — |
| Temperatura de operação | -40C to +105C | [DATA_NEEDED: operating temperature range] |
| I/O Ports | 39 | — |
| LCD Segments (max) | Up to 296 | — |
| LCD Charge Pump | Integrated, up to 7x bias | — |
| ADC | Integrated (peripheral count/configuration per datasheet) | — |
| Timers | MTIM, FTM (per datasheet) | — |
| Communication Peripherals | SCI, SPI, I2C | — |
| Debug Interface | On-chip ICE, BDM, JTAG boundary scan | Background debugging system (single-wire BDM) |
| Encapsulamento | 80-pin LQFP (14x14 mm), 0.5 mm pitch | 8-SOIC |
| Tipo de montagem | Surface Mount | Surface Mount |
| Lifecycle Stage | ACTIVE | — |
| Status RoHS | Compliant | — |
| Automotive Qualified | Yes | — |
| Nível MSL | [DATA_NEEDED: MSL rating] | — |
| Core Processor | — | S08 (HCS08), 8-bit CISC |
| Core Size | — | 8-bit |
| Frequência máxima de clock | — | 16 MHz |
| Flash Memory | — | 4 KB (4K x 8) |
| Tensão de alimentação | — | 3.3 V / 5 V |
| ADC Resolution | — | 10-bit |
| ADC Channels | — | 4 |
| General-Purpose I/O | — | 6 |
| Instruction Set | — | HC08 with added BGND instruction |
| Packaging | — | Tube |
| Life Cycle Stage | — | End of Life (per NXP product page) |