S9S08QD2J1MSC vs MC9S08SH4MFK Vergleich
Detaillierter Direktvergleich von S9S08QD2J1MSC von NXP Semiconductors und MC9S08SH4MFK von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | S9S08QD2J1MSC | MC9S08SH4MFK |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $0,89 | $2,15 |
| Core | HCS08 (S08) 8-bit CISC | HCS08 (8-bit) |
| Program Memory (Flash) | 2 KB (2K x 8) | — |
| RAM Size | 128 bytes | 256 B |
| Maximum CPU Frequency | 16 MHz | — |
| Supply Voltage (Vcc/Vdd) | 2.7 V to 5.5 V | — |
| Betriebstemperatur | -40C to +125C (Automotive Grade) | -40 C to +85 C (industrial, [DATA_NEEDED: confirm exact grade]) |
| Number of I/O Pins | 4 | 17 |
| Gehäuse | 8-pin SOIC (SOIC-8) | — |
| Montageart | Surface Mount | Surface Mount |
| Peripherals | LVD, POR, PWM, WDT | — |
| Connectivity | - | — |
| Debug Interface | Single-wire Background Debug Mode (BDM) | — |
| EEPROM | None (Flash-based) | — |
| MSL-Level | [DATA_NEEDED: MSL rating] | — |
| RoHS-Status | Compliant | — |
| AEC-Q100 | Qualified (Automotive) | — |
| Program Memory Size | — | 4 KB (4K x 8) Flash |
| Maximum CPU Clock | — | 40 MHz |
| Gehäuse / Bauform | — | 24-VFQFN Exposed Pad (4x4 mm) |
| Supply Voltage Range | — | 2.7 V to 5.5 V |
| ADC | — | 12-channel, 10-bit, 2.5 us conversion |
| Oscillator Type | — | Internal |
| Interrupt/Reset Sources | — | Up to 32 |
| Instruction Set | — | HC08 with BGND instruction |
| Packaging | — | Tray |
| Compliance | — | RoHS compliant ([DATA_NEEDED: confirm exact status]) |