S9S08QD2J1MSC vs MC9S08SH4MFK Comparación
Comparación detallada lado a lado de S9S08QD2J1MSC por NXP Semiconductors y MC9S08SH4MFK por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MC9S08SH4MFK - 8-bit HCS08 MCU 4KB Flash 40MHz QFN-24 | NXP
MC9S08SH4MFK ✓ ActivoComparación de especificaciones
| Parámetro | S9S08QD2J1MSC | MC9S08SH4MFK |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $0,89 | $2,15 |
| Core | HCS08 (S08) 8-bit CISC | HCS08 (8-bit) |
| Program Memory (Flash) | 2 KB (2K x 8) | — |
| RAM Size | 128 bytes | 256 B |
| Maximum CPU Frequency | 16 MHz | — |
| Supply Voltage (Vcc/Vdd) | 2.7 V to 5.5 V | — |
| Temperatura de funcionamiento | -40C to +125C (Automotive Grade) | -40 C to +85 C (industrial, [DATA_NEEDED: confirm exact grade]) |
| Number of I/O Pins | 4 | 17 |
| Encapsulado | 8-pin SOIC (SOIC-8) | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Peripherals | LVD, POR, PWM, WDT | — |
| Connectivity | - | — |
| Debug Interface | Single-wire Background Debug Mode (BDM) | — |
| EEPROM | None (Flash-based) | — |
| Nivel MSL | [DATA_NEEDED: MSL rating] | — |
| Estado RoHS | Compliant | — |
| AEC-Q100 | Qualified (Automotive) | — |
| Program Memory Size | — | 4 KB (4K x 8) Flash |
| Maximum CPU Clock | — | 40 MHz |
| Encapsulado / Carcasa | — | 24-VFQFN Exposed Pad (4x4 mm) |
| Supply Voltage Range | — | 2.7 V to 5.5 V |
| ADC | — | 12-channel, 10-bit, 2.5 us conversion |
| Oscillator Type | — | Internal |
| Interrupt/Reset Sources | — | Up to 32 |
| Instruction Set | — | HC08 with BGND instruction |
| Packaging | — | Tray |
| Compliance | — | RoHS compliant ([DATA_NEEDED: confirm exact status]) |