S9S08SG16E1VTJ vs S9S08SG4E2MTJ Vergleich
Detaillierter Direktvergleich von S9S08SG16E1VTJ von NXP Semiconductors und S9S08SG4E2MTJ von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
S9S08SG4E2MTJ - 8-bit S08 MCU, 4KB Flash, 40MHz | NXP
S9S08SG4E2MTJ ✗ AbgekündigtSpezifikationsvergleich
| Parameter | S9S08SG16E1VTJ | S9S08SG4E2MTJ |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | Ende des Lebenszyklus |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $0,00 | $0,85 |
| Core Processor | S08 (HCS08), 8-bit CISC | — |
| Core Size | 8-bit | — |
| Maximum CPU Speed | 40 MHz | — |
| Program Memory Size | 16 KB (16K x 8) Flash | — |
| RAM Size | 512 B (NXP product page; one distributor listing states 1K x 8) | — |
| Number of I/O | 16 | — |
| Versorgungsspannung | 3.3 V / 5 V | 2.7 V to 5.5 V |
| Oscillator Type | Internal | — |
| Betriebstemperatur | -40C to +105C | -40 degC to +125 degC |
| Qualification | Automotive Qualified (family qualified to meet or exceed AEC Grade 0, up to 150C TA for high-temp grades) | — |
| Gehäuse / Bauform | 20-TSSOP (0.173", 4.40 mm width) | — |
| Montageart | Surface Mount | Surface Mount |
| Packaging | Tube | — |
| Connectivity | LIN (family targeted at LIN slave applications) | — |
| Integrated Analog | Yes (integrated analog per NXP product page) | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | RoHS Compliant |
| Data Converter | [DATA_NEEDED: ADC resolution detail] | — |
| Core | — | S08 (HCS08) 8-bit CPU |
| Core Clock Speed | — | 40 MHz |
| Flash Memory | — | 4 KB (4K x 8) |
| RAM | — | 256 B |
| Automotive Qualification | — | Automotive Qualified (AEC-Q100 family grade) |
| Interrupt/Reset Sources | — | Up to 32 |
| Instruction Set | — | HC08 with added BGND instruction |
| Debug Interface | — | Background Debug Mode (BDM) |
| Gehäuse | — | 20-TSSOP (MTJ) |
| I/O Ports | — | [DATA_NEEDED: I/O port count] |
| Peripheral Set | — | [DATA_NEEDED: detailed peripheral list (timers, SCI, ADC)] |
| Lebenszyklusstatus | — | End of Life (per NXP product page) |
| Target Applications | — | LIN slave, general market, high-temperature, space-constrained |