S9S08SG16E1VTJ - 8-bit S08 MCU, 16KB Flash, 40MHz | NXP
Teilenummer: S9S08SG16E1VTJ ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $1.3905 | $1,39 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1.000 | $0 | $0,00 |
S9S08SG16E1VTJ Übersicht
An 8-bit MCU is a single-chip microcontroller whose arithmetic logic unit processes data 8 bits at a time. Within the semiconductor hierarchy it sits under the microcontroller unit (MCU) category, alongside 16-bit and 32-bit MCUs, and belongs to NXP's entry-level to mid-range 8-bit portfolio. The S08SG family targets LIN slave nodes, general-market embedded control, high-temperature environments, and space-constrained PCB designs where cost per unit is a dominant constraint.
Key differentiating features include the 40 MHz enhanced HCS08 core with CISC instruction set, an internal oscillator that removes the need for an external crystal in many designs, 16 general-purpose I/O lines, and automotive qualification for demanding under-hood and body-electronics environments. The device operates from a 3.3V or 5V supply, giving designers flexibility across legacy 5V automotive rails and modern 3.3V systems.
Technically, the S9S08SG16 is a member of the Freescale-derived MC9S08SG32 datasheet family, which NXP documents as qualified to meet or exceed AEC Grade 0 requirements, allowing operation up to 150C TA for the high-temperature series grades. The family integrates on-chip analog peripherals suitable for cost-sensitive sensing tasks, with the 20-pin TSSOP (4.40 mm width) providing a small 6.5 mm x 4.4 mm body footprint for dense boards.
Typical applications include LIN slave nodes in automotive body electronics, door modules, seat control, small motor control, appliance control panels, and general embedded sensing where a small-footprint, low-cost 8-bit controller with integrated analog is sufficient.
A key design consideration is memory headroom: at 16 KB Flash and 512 B RAM, complex protocol stacks should be evaluated carefully against the larger 32 KB SG32 variants, which share the same package and core.
This page synthesizes distributor pricing, drop-in alternatives within the SG/SL families, comparison tables, and practical design notes not found in the manufacturer datasheet alone.
Drop-in-Alternativen für S9S08SG16E1VTJ – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit S9S08SG16E1VTJ (gleiche Bauform und Footprint) – abweichend in Operating Temperature, Supply Voltage, Core Processor, Lifecycle Status, Program Memory Size.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MC9S08SG16E1VTJ
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
S9S08SG32E1VTJ
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
S9S08SG4E2MTJ
✅ Drop-In✓ Auf Lager
$0.85 / Stück
Datenblatt ansehen →S9S08SL16F1MTJ
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
S9S08SG16E1VTJ Grenzwerte & elektrische Eigenschaften
| Core Processor | S08 (HCS08), 8-bit CISC |
| Core Size | 8-bit |
| Maximum CPU Speed | 40 MHz |
| Program Memory Size | 16 KB (16K x 8) Flash |
| RAM Size | 512 B (NXP product page; one distributor listing states 1K x 8) |
| Number of I/O | 16 |
| Versorgungsspannung | 3.3 V / 5 V |
| Oscillator Type | Internal |
| Betriebstemperatur | -40C to +105C |
| Qualification | Automotive Qualified (family qualified to meet or exceed AEC Grade 0, up to 150C TA for high-temp grades) |
| Gehäuse / Bauform | 20-TSSOP (0.173", 4.40 mm width) |
| Montageart | Surface Mount |
| Packaging | Tube |
| Connectivity | LIN (family targeted at LIN slave applications) |
| Integrated Analog | Yes (integrated analog per NXP product page) |
S9S08SG16E1VTJ 20-tssop (0.173", 4.40 mm width) Pinbelegungsleitfaden
Pinbelegung für S9S08SG16E1VTJ (20-tssop (0.173", 4.40 mm width)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für S9S08SG16E1VTJ.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
S9S08SG16E1VTJ ist geeignet für 6 Anwendungs: Automotive LIN Slave Nodes, Door Module and Body Electronics Control, Small DC Motor and Actuator Control, Appliance Control Panels, Sensor Conditioning and Data Acquisition Nodes, High-Temperature Embedded Control.
Automotive LIN Slave Nodes
NXP explicitly targets the S08SG family at LIN slave applications. The S9S08SG16E1VTJ pairs its 40 MHz S08 core with an internal oscillator, allowing LIN baud-rate generation without an external crystal and reducing BOM cost in high-volume nodes. With 16 KB Flash and 512 B RAM, it comfortably hosts a LIN 2.x slave stack plus application logic for window lifts, seat adjusters, mirrors, and wiper controls. Its -40C to +105C rating and automotive qualification address the thermal environment of door modules and cabin electronics, and the 20-pin TSSOP conserves board area in mechatronic modules where the PCB often lives inside the actuator housing.
Empfohlen
Door Module and Body Electronics Control
Body-electronics submodules such as door locks, mirror folding, and interior lighting demand low cost, small footprint, and automotive-grade reliability. The S9S08SG16E1VTJ fits all three constraints: the 20-pin TSSOP (4.40 mm width) minimizes PCB area, the 16 I/O lines directly drive switches, relays and indicator LEDs, and integrated analog supports switch debouncing and simple sensor reading without external components. The 3.3V/5V operating range matches legacy 5V automotive rails, while the automotive qualification and -40C to +105C temperature rating satisfy module-level validation requirements typical of Tier-1 body electronics programs.
Empfohlen
Small DC Motor and Actuator Control
Seat adjusters, HVAC flaps, and pump actuators require simple closed-loop control with PWM output and feedback sensing. The S9S08SG16E1VTJ's 40 MHz S08 core provides enough throughput for PWM generation and current-feedback sampling, while its integrated analog front end supports position and current sensing with minimal external circuitry. The 16 general-purpose I/O map cleanly onto H-bridge driver interfaces, and the 16 KB Flash accommodates control loops plus fault diagnostics. The internal oscillator simplifies clocking in cost-driven actuator designs, and the TSSOP-20 package fits the compact driver PCBs typical of mechatronic actuators.
Empfohlen
Appliance Control Panels
Cost-sensitive white-goods and small-appliance controls - coffee machines, fans, dispensers - benefit from the S9S08SG16E1VTJ's combination of internal oscillator (no crystal on the BOM), 5V operation directly compatible with appliance power supplies, and integrated analog for button sensing and temperature measurement via NTC inputs. The 16 KB Flash stores UI state machines, LED multiplexing, and simple communication routines, while 16 I/O lines handle a keypad matrix and status indicators within a single TSSOP-20 device. The -40C to +105C rating also covers kitchen-ambient and near-motor mounting positions where consumer-grade parts would be marginal.
Empfohlen
Sensor Conditioning and Data Acquisition Nodes
Distributed sensing nodes for pressure, temperature, and position need a compact MCU with onboard analog conversion and serial output. The S9S08SG16E1VTJ integrates analog peripherals suited to ratiometric sensor signal conditioning, and the S08 core performs offset/gain compensation in firmware within its 16 KB Flash budget. The internal oscillator eliminates crystal placement on small sensor PCBs, and the -40C to +105C automotive-qualified range permits under-hood and chassis sensor locations. The 20-pin TSSOP with 16 I/O also supports local digital outputs or threshold flags alongside the serial data link to a central ECU.
Empfohlen
High-Temperature Embedded Control
The broader S08SG family is qualified to meet or exceed AEC Grade 0 requirements, with high-temperature grades operating up to 150C TA per the Freescale/NXP family documentation. Where a design must sit close to heat sources - engine-bay sensor modules, transmission controllers, exhaust-adjacent actuators - the SG16 in its automotive-qualified S9 version offers a low-cost 8-bit controller rated -40C to +105C, with family grades extending higher. The 20-pin TSSOP's small thermal mass reaches ambient quickly but its low internal dissipation at typical S08 clocking keeps junction rise modest, simplifying thermal validation in enclosed modules.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für S9S08SG16E1VTJ – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MC9S08SG16E1VTJ | S9S08SG32E1VTJ | S9S08SG4E2MTJ | S9S08SL16F1MTJ |
|---|---|---|---|---|---|
| Package | 20-TSSOP (4.40 mm width) | 20-TSSOP - same | 20-TSSOP - same | 20-TSSOP - same | 20-TSSOP - same |
| Brand | NXP Semiconductors | NXP Semiconductors (Freescale legacy) | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core / Speed | S08 (HCS08), 40 MHz | S08, 40 MHz | S08, 40 MHz | S08, 40 MHz | S08, 40 MHz |
| Flash Memory | 16 KB | 16 KB | 32 KB | 4 KB | 16 KB |
| Automotive Qualification | Yes (S9 prefix, family AEC Grade 0 basis) | No (standard grade) | Yes | Yes (S9 prefix) | Yes (S9 prefix) |
| Oscillator | Internal | Internal | Internal | Internal | Internal |
Wichtigste Unterscheidungsmerkmale
- Automotive qualification with high-temperature family pedigree (vs. MC9S08SG16E1VTJ)
- Same-package memory upgrade path (vs. S9S08SG32E1VTJ)
- Integrated analog plus internal oscillator reduces BOM (vs. S9S08SL16F1MTJ)
Designhinweise
Verify the RAM size before committing firmware: the NXP product page states 512 B while a distributor datasheet summary lists 1K x 8 for this part. A LIN stack plus application buffers can exhaust 512 B quickly, so confirm against the current MC9S08SG32 family datasheet revision. Also confirm pin multiplexing when migrating between SG and SL family parts - peripheral assignments on shared pins differ even when the TSSOP-20 outline matches.
The device operates from 3.3V or 5V rails. On 5V automotive supplies, add local decoupling (100 nF ceramic at the VDD pin plus bulk capacitance) and consider a series ferrite to suppress load-dump transients conducted through the harness. If using the internal oscillator for LIN communication, review clock tolerance over the full -40C to +105C range in the family datasheet, since LIN requires protocol-level baud accuracy that may impose trimming or calibration in firmware.
The 20-TSSOP has 0.5 mm lead pitch; use standard TSSOP-20 land patterns per IPC guidance and route analog sensor traces away from switching nodes. Reserve at least one spare GPIO routed to a test point for in-circuit debug and production programming of the Flash through the background debug interface. Keep the internal-oscillator design free of nearby crystal footprints only if timing analysis confirms the internal source is adequate; otherwise provide pads for an external reference.
Compliance-Informationen
Automotive qualified per distributor datasheet summary; family qualified to meet or exceed AEC Grade 0 requirements per Freescale family documentation. RoHS/REACH/lead-free status not stated in provided data - verify on NXP product page.
